System and method for fluid cooling of electronic devices installed in a sealed enclosure

ABSTRACT

A system and method for cooling electronic devices disposed with the innermost volume of a fluid-tight sealed enclosure. Thermally conductive fluids that fill one or more volumes of said sealed enclosure may be circulated away from said sealed enclosure to an external heat exchange mechanism. The innermost volume of the sealed container contains one or more single phase or multi-phase thermally conductive fluids, which may be circulated passively by convection or actively by means of a pump, bubbler, fan, propeller or other means. Pressure balancing mechanisms may be included to maintain suitable pressure of gaseous fluid in a volume of the sealed container.

RELATED APPLICATION

This application is a continuation-in-part of U.S. patent applicationSer. No. 14/749,615, filed on Jun. 24, 2015 and entitled “APPARATUS ANDMETHOD FOR FLUID COOLING OF ELECTRONIC DEVICES INSTALLED IN ANENCLOSURE”, now issued as U.S. Pat. No. 9,258,926, issued on Feb. 9,2016, which claims priority of U.S. Provisional 62/016,638, filed onJun. 24, 2014 and entitled “FLUID COOLING OF ELECTRONIC DEVICESINSTALLED IN A SEALED ENCLOSURE”, and U.S. Provisional 62/060,290, filedon Oct. 6, 2014 and entitled “SYSTEM AND METHOD FOR FLUID COOLING OFELECTRONIC DEVICES INSTALLED IN A SEALED ENCLOSURE”, and claims priorityof U.S. Provisional 62/272,751, filed on Dec. 30, 2015 and entitled“SYSTEM AND METHOD FOR FLUID COOLING OF ELECTRONIC DEVICES INSTALLED INA SEALED ENCLOSURE”, all of which are hereby incorporated by referencein their entirety.

TECHNICAL FIELD

This disclosure relates to a system and method for cooling electronicdevices, including but not limited to computer systems, by installingthe electronic devices in a fluid-tight enclosure, said enclosureconstructed with various configurations of heat exchange and pressurecontrol mechanisms.

BACKGROUND

Electronic devices generate significant amounts of thermal energy duringoperation. The functional lifetime of electronic devices issignificantly diminished by excess heat buildup. Therefore, a number ofmethods have been presented to remove thermal energy from electronicdevices and reject it into an external environment. Since the beginningsof electronic devices, air movement over these devices has been theprimary means of heat removal. For example, in the early large-scalecomputing systems of the 1940s and 1950s, heat dissipation consistedprimarily of ventilation apertures in housings, followed by ambient-airfans and blowers which cooled by forced air convection. Even today,refined versions of these early air-based heat dissipation systems arethe most common means of electronic device and computer systems cooling.In air-based heat dissipation systems, air within a device enclosure isheated by the electronic device and internal fans expel heated air intothe immediate environment around the device. The environment around thedevice is typically maintained with regards to temperature, humidity,and particulate matter, by using compression-based heat exchange withthe outside environment. This process is effective and in common use fornon-stop electronic devices such as computer servers. Although thisprocess is effective, it is complex process with a number of systemsthat must be constantly maintained to produce the desired environmentthus having high construction and operational costs. For example,air-based cooling relies on a) the proper operation of fans to circulateair inside the device enclosure, in the server room, and in outsidecondensers, b) a very clean environment free of most dust andparticulates, c) proper humidity control, and d) costly “white space” inthe server room to allow human access to electronic devices for repairand maintenance. Air based cooling faces significant risks from a)internal fan and cooling failures, b) server room cooling failures andinconsistencies, c) fire control systems, d) unauthorized human access,e) maintenance failures and mistakes, and f) natural disasters. Takentogether, these factors typically require specialized and costlyinstallation space for electronic devices such as computer servers.Further, air-based cooling of electronic systems can double the totalamount of electrical energy required to operate these systems, resultingin a costly and wasteful means of operating such systems.

Noting the inefficiencies and problems with air-based heat dissipation,designs begin to arise in the 1960s and 1970s that took advantage of themuch higher thermal conductivity of liquids, which typically conductheat ten to one hundred times more rapidly than gases. Liquid vaporcooling of individual semiconductors and other solid state componentswas disclosed by Davis in U.S. Pat. No. 3,270,250, and in U.S. Pat. No.3,524,497, Chu et. al. disclose a double-walled container forcomponent-level electronics, with liquid flow in the space between thewalls. The predominance of such designs focused on component levelcooling of larger systems.

As individual CPU processing speed and power increased during the 1980s,inventors continued to disclose methods for additional coolingcapability in electronic assemblies. Many of these disclosures relatedto component level cooling, but a few began to focus on system levelliquid cooling. Cray, in U.S. Pat. No. 4,590,538 (1986), discloses ameans of immersing an entire electronic assembly in coolant liquid, andcirculating the liquid out of the assembly container for the purpose ofthermal energy removal. Numerous other methods of liquid cooling ofcomponents and component assemblies continued to be disclosed throughoutthe 1990s. In the late 2000s, the liquid cooling designs from the 1980sand 1990s were applied to individual servers and computing systems.These innovations were followed by modifications and improvements whichincorporated liquid cooling elements into the structural design ofcomputing systems rather than individual modules or computing units. Forexample, in U.S. Pat. No. 8,351,206, Campbell et. al. disclose aliquid-cooled electronics rack with immersion-cooled electronics and avertically mounted vapor condensation unit attached to or adjacent tothe electronics rack.

Olsen, et. al. describe in U.S. Pat. No. 8,416,572 a design for multipleelectronic devices connected in an array, thermally coupled to a flowingliquid. In U.S. Pat. No. 8,467,189 and related following patentsAttlesey discloses designs for an array of rack-mounted plurality ofcases for electronics systems; each case contains a dielectric fluid forheat conduction, and the rack system incorporates a manifold for liquidcirculation through the plurality of cases, with a pump and heatexchanger incorporated into the fluid circulation loop. Best et. al.disclose, in U. S. Patent Application 2011/0132579 a design in which aseries of horizontally oriented computer server racks are submerged in aliquid tank containing a dielectric cooling fluid that is circulatedfrom the tank to a remote heat exchanger and back into the tank.

One of the significant improvements of liquid cooling over air coolingis the ability to transport heat from the electronic device or systemdirectly to the heat rejection environment without significantlyaffecting the human inhabited space in the server room thus dramaticallyincreasing the heat transport efficiency while reducing the number ofcooling processes and preventing excess heat diffusion. However, theseprocesses have not seen widespread adoption for one or more possiblereasons. Component level liquid cooling designs tend to introducesignificant complexity to operations and maintenance while increasingserver room risks to coolant leaks and failures. System level liquidcooling designs reduce the overall number of cooling interconnects, buthave similar problems. To further complicate the liquid cooling serverroom installations, liquid cooled systems require new server roomprocedures, operations, and training and expose owner and operators toadditional liabilities from liquid damage. And notably, productionelectronic devices and servers are rarely available in liquid coolingconfigurations. Succinctly, the cost savings associated with currentliquid cooling designs are overshadowed by the increased costs ofpurchasing, constructing, and operating liquid cooled servers andsolutions.

Significantly, it is the widespread usage of virtualized computingresources that is allowing greater innovation and deployment of fluidcooled electronic devices and servers. Virtualization of data resourcesallows data to be stored on many redundant devices. Virtualization ofcompute resources allows the functional compute unit of a “server” tobecome a software unit that can be moved from one physical computer toanother. Individual electronic devices and servers may fail over time,but the virtualized nature of software based compute and storage unitsmean that an individual failures only slightly decreases the overallcapability of a collection of servers but in no way compromises the dataprocessing, storage, and communication functions as a whole. Therefore,since it is no longer necessary to maintain or repair a specificphysical server in order to maintain a given operation, fluid cooling ofelectronic devices in a sealed enclosure is enabling cost reductions,operational efficiencies, increased security, and extended longevity ofelectronic devices and servers.

The innovations as disclosed herein overcome problems inherent to bothtraditional air-cooled and liquid-cooled electronic devices and systems.Significant benefits comprise a) high efficiency cooling and heatexchange reducing overall energy usage by up to 50%, b) no maintenancerequired, c) devices and systems can be installed in almost anyenvironment such as a traditional data center, high rise office,industrial building, offshore installation, underground installation,and ambient air data center, d) increasing server density up to 3× thecurrent high-density server deployments thus reducing the amount ofserver room space required, e) improved physical security, f) improvedEMI/RFI security, g) decreased labor costs, h) more protection againstdisasters such as fire, hurricane, and earthquake, i) fewer maintenancefailures and mistakes, j) tamper-resistant to unauthorized human access,k) reduced or eliminated damage due to fire control systems, l) nearlysilent in operation, m) internal components have cooler averagetemperature that will increase the life of the system, and n) imperviousto environmental factors such as dust and humidity.

These and other benefits disclosed herein combine together to createentirely new classes of solutions. For example, innovation in the fluidcooling of electronic devices as disclosed herein, and innovations thatallow for a broader range of installation environments are disclosed bySmith in U. S. Patent Appl. No. 2015/0000319 (January 2015) arechallenging the assumptions and designs of data centers and serverrooms.

Unless specifically stated as such, the preceding is not admitted to beprior art and no statement appearing in this section should beinterpreted as a disclaimer of any features or improvements listed.

BRIEF DESCRIPTION OF THE INVENTION

Various embodiments of a system and method for fluid cooling ofelectronic devices installed in sealed enclosures are disclosed herein.

At least one embodiment described herein provides a cooling system forelectronic devices installed in a sealed enclosure. Such embodiments areoptimized for effective and efficient direct and indirect transfer ofthermal energy away from heat-generating electronics into thesurrounding environment. Designs embody enclosing structures comprisedof walls that enclose an interior sealed space containing heatgenerating components and a dielectric thermally conductive fluid(“primary dielectric thermally conductive fluid”). The enclosure may becomprised of single wall construction that enclose an innermost volumeor may be comprised of inner, outer, and optional intermediate walls.Secondary thermally conductive fluids may be circulated within theenclosure walls and/or through an innermost heat exchange mechanism toan external local or remote heat exchange loop. The innermost volume ofthe enclosure may optionally contain a heat exchange mechanism thoughwhich a secondary thermally conductive fluid is circulated to anexternal local or remote heat exchange loop. The sealed enclosure may belocated in a variety of environments comprising raised or slab floordatacenters, commercial buildings, residential buildings, outdoorlocations, subsurface structures, and direct subsurface installation.The design leads to significant reductions in capital, infrastructure,power, cooling, maintenance, and operational costs associated withdeploying computing hardware. In addition, the design provides for ahigh degree of physical, electrical, and magnetic security for theenclosed electronics.

Electronic devices may be disposed within the interior of the sealedenclosure in a variety of configurations to facilitate thermal transferand best practice process efficiency. The enclosed electronic devicesdissipate internally generated heat into the innermost volume, theprimary dielectric thermally conductive fluid, optional innermost heatexchanger, and the innermost thermally conductive walls of the sealedenclosure. The walls of the enclosure may be thermally connected bymechanical connection or other means. Cooling fins may be affixed to anywall surfaces to aid in heat transport and dissipation. Any wallsurfaces may have surface features of various dimensionality to aid inheat transport and dissipation.

In embodiments with a plurality of enclosing walls, the sealed enclosurecomprises a unit with an innermost volume formed by a plurality of wallswhich form one or more enclosing volumes within said walls. Theinnermost volume contains a single phase or multi-phase primarydielectric thermally conductive fluid in which electronic devices to becooled are immersed and/or surrounded as well as an optional heatexchange mechanism through which is circulated a single phase ormulti-phase secondary thermally conductive fluid (“secondary thermallyconductive fluid”). Optionally, located between any two surfaces of theenclosure walls are structures that comprise one or more channels thatcontain a single phase or multi-phase secondary thermally conductivefluid. Innermost and intermediate walls are thermally conductive and areoptimized by composition and construction to provide for optimal heattransfer away from the innermost volume. In embodiments in which theenclosure is comprised of single wall construction that enclose aninnermost volume, the innermost volume contains a single phase ormulti-phase primary dielectric thermally conductive fluid in whichelectronic devices to be cooled are immersed and/or surrounded as wellas an optional heat exchange mechanism through which is circulated asingle phase or multi-phase secondary thermally conductive fluid.

Some embodiments may use multiple enclosed and segregated secondarythermally conductive fluids by using intermediate walls or heatexchangers in the innermost volume for the purpose of optimizing thethermal requirements. Secondary thermally conductive fluid(s) may bepresented to one or more heat exchange mechanisms for the purpose ofremoving heat from the fluid(s). Heat exchange may be accomplished by avariety of means to one or more external heat sink systems that may beof various types including ventilation, compression, evaporation,absorption, or geothermal systems. The heat exchange system may rejectheat directly into the immediate environment of the sealed enclosure viapassive or forced circulation, or fluid may be circulated away from thesealed enclosure, cooled in a remote location, and then re-circulatedback to the sealed enclosure at a lower temperature. The outermostexterior walls may be thermally conductive or thermally insulating.Various and diverse thermally conductive fluids may be used to supportthe cooling of electronic devices within a sealed enclosure at aparticular thermodynamic rate. For example, an embodiment could use amulti-phase thermally conductive fluid that allows rapid dissipation ofthe heat from high temperature electronic devices such as a computerwith CPUs while other embodiments could use a single phase thermallyconductive fluid for general heat transfer of lower powered electronicdevices.

The sealed enclosure has fluid-tight entrances from the outermostsurface to the innermost volume for power, networking, and other controland monitoring signals and functions. In addition, the sealed enclosuremay optionally comprise fluid-tight entrances from the outermost surfaceto the innermost volume for gaseous fluid exchange with the innermostvolume for the purpose of pressure equalization, fluid maintenance,and/or supplying motive force to kinetic process components located insaid innermost volume.

The sealed enclosure may contain internal pressure balancing mechanismsfor the purpose of maintaining suitable pressures of gaseous fluids in avolume of the sealed container. To enhance the security of theelectronic devices in the sealed enclosure, a functional “poison pill”system may be implemented to provide an electrical, magnetic, chemical,and/or mechanical means of rendering the electronic devices and anycontent stored on those devices to be permanently unusable andunreadable.

Multiple configuration options are described to optimize installation ofsealed enclosures into a variety of environments, such as homes,offices, businesses, datacenters, and specialty computing installations.The installation can be in any orientation and can be located in surfaceor sub-surface environments. Sealed enclosures be installed asstandalone units or may be stacked or grouped together to form a singlestructural unit of any dimensionality in a high-density configuration.

In general, the sealed enclosure described contains no user serviceableelectronic devices. The devices are typically used until they are nolonger useful at which point they are completely replaced. Typicallythese units are deployed in multiples and utilize system designs thatallow for redundant failover of non-functioning devices.

These and other aspects of the disclosed subject matter, as well asadditional novel features, will be apparent from the descriptionprovided herein. The intent of this summary is not to be a comprehensivedescription of the claimed subject matter, but rather to provide a shortoverview of some of the subject matter's functionality. Other systems,methods, features and advantages here provided will become apparent toone with skill in the art upon examination of the following FIGS. anddetailed description. It is intended that all such additional systems,methods, features and advantages that are included within thisdescription, be within the scope of the claims.

BRIEF DESCRIPTION OF FIGURES

The features characteristic of the invention are set forth in theclaims. However, the invention itself and further objectives andadvantages thereof, will best be understood by reference to thefollowing detailed description when read in conjunction with theaccompanying drawings in which the left-most significant digit(s) in thereference numerals denote(s) the first figure in which the respectivereference numerals appear, wherein:

FIG. 1 shows a conceptual view of a sealed enclosure design comprisingoutermost and innermost enclosure walls that enclose electronic devices,a primary dielectric thermally conductive fluid, and optional heatexchange mechanism in the innermost volume and a secondary thermallyconductive fluid within the walls according to an embodiment of thedisclosed subject matter.

FIG. 2 shows a conceptual view of a sealed enclosure design comprisingoutermost, intermediate, and innermost enclosure walls that encloseelectronic devices, a primary dielectric thermally conductive fluid, andoptional heat exchange mechanism in the innermost volume and one or moresecondary thermally conductive fluids and optional heat exchangemechanism within the walls according to an embodiment of the disclosedsubject matter.

FIG. 3 shows a conceptual view of a single port pressure balancingmechanism used to relieve positive and negative pressures in a sealedenclosure, optional heat exchange mechanisms, and optional primarydielectric thermally conductive fluid pump circulation mechanismsaccording to an embodiment of the disclosed subject matter.

FIG. 4 shows a conceptual view of a dual port pressure balancingmechanism used to relieve positive and negative pressures in a sealedenclosure, optional heat exchange mechanisms, and optional primarydielectric thermally conductive fluid pump circulation mechanismsaccording to an embodiment of the disclosed subject matter.

FIG. 5 shows a conceptual view of a dual port pressure balancingmechanism used to relieve positive and negative pressures in a sealedenclosure, optional heat exchange mechanisms, and optional pressurizedgaseous fluid driven primary dielectric thermally conductive fluid pumpand bubbler circulation mechanisms according to an embodiment of thedisclosed subject matter.

FIG. 6 shows a conceptual view of an internal pressure balancingmechanism with optional dual port pressure balancing mechanism used torelieve positive and negative pressures in a sealed enclosure, optionalheat exchange mechanisms, and optional primary dielectric thermallyconductive fluid pump circulation mechanisms according to an embodimentof the disclosed subject matter.

FIG. 7 shows a conceptual view of an internal pressure balancingmechanism with dual port pressure balancing mechanism used to relievepositive and negative pressures in a sealed enclosure, optional heatexchange mechanisms, and optional pressurized gaseous fluid drivenprimary dielectric thermally conductive fluid pump and bubblercirculation mechanisms according to an embodiment of the disclosedsubject matter.

FIG. 8 shows a conceptual view of a dual port pressure balancingmechanism and/or an internal pressure balancing mechanism used torelieve positive and negative pressures in the intermediate wall of asealed enclosure and optional primary dielectric thermally conductivefluid pump circulation mechanisms according to an embodiment of thedisclosed subject matter.

FIG. 9 shows a conceptual view of a sealed enclosure design comprisingenclosure walls that enclose electronic devices, a primary dielectricthermally conductive fluid, and an optional heat exchange mechanism inthe innermost volume that contains a secondary thermally conductivefluid according to an embodiment of the disclosed subject matter.

FIG. 10 shows a conceptual view of a single port pressure balancingmechanism used to relieve positive and negative pressures in a sealedenclosure and optional primary dielectric thermally conductive fluidpump circulation mechanisms according to an embodiment of the disclosedsubject matter.

FIG. 11 shows a conceptual view of a dual port pressure balancingmechanism used to relieve positive and negative pressures in a sealedenclosure and optional primary dielectric thermally conductive fluidpump circulation mechanisms according to an embodiment of the disclosedsubject matter.

FIG. 12 shows a conceptual view of a dual port pressure balancingmechanism used to relieve positive and negative pressures in a sealedenclosure and optional pressurized gaseous fluid driven primarydielectric thermally conductive fluid pump and bubbler circulationmechanisms according to an embodiment of the disclosed subject matter.

FIG. 13 shows a conceptual view of an internal pressure balancingmechanism with optional dual port pressure balancing mechanism used torelieve positive and negative pressures in a sealed enclosure andoptional primary dielectric thermally conductive fluid pump circulationmechanisms according to an embodiment of the disclosed subject matter.

FIG. 14 shows a conceptual view of an internal pressure balancingmechanism with dual port pressure balancing mechanism used to relievepositive and negative pressures in a sealed enclosure and optionalpressurized gaseous fluid driven primary dielectric thermally conductivefluid pump and bubbler circulation mechanisms according to an embodimentof the disclosed subject matter.

FIG. 15 shows a conceptual view of channels to direct the flow ofprimary dielectric thermally conductive fluid within a sealed enclosureaccording to an embodiment of the disclosed subject matter.

FIG. 16 shows a conceptual view of channels to direct the flow ofprimary dielectric thermally conductive fluid within a sealed enclosureaccording to an embodiment of the disclosed subject matter.

FIG. 17 shows a conceptual view of structures for the volumetricdisplacement of primary dielectric thermally conductive fluid within asealed enclosure according to an embodiment of the disclosed subjectmatter.

FIG. 18 shows a conceptual view of mechanisms that provide a means ofrendering a portion of the electronic devices with a sealed enclosureand any content stored on those devices to be permanently unusable andunreadable according to an embodiment of the disclosed subject matter.

DETAILED DESCRIPTION

Although described with reference to certain embodiments, those withskill in the art will recognize that the disclosed embodiments haverelevance to a wide variety of areas in addition to those specificexamples described below. Further, elements from one or more embodimentsmay be used in other embodiments and elements may be removed from anembodiment and remain within the scope of this disclosure.

All references, including publications, patent applications, andpatents, cited herein are hereby incorporated by reference to the sameextent as if each reference were individually and specifically indicatedto be incorporated by reference and were set forth in its entiretyherein; provided, however, to the extent there exists a conflict betweenthis disclosure and a document incorporated by reference, thisdisclosure shall control.

As referenced herein, the terms “sealed enclosure” and “containmentvessel” are used interchangeably.

As referenced herein, the terms “electronic device”, “electronicdevices”, “computer”, “computer systems”, “computer cluster”, “physicalcomputer”, “computer server”, and “server” are used interchangeably, andunless otherwise specified comprise any electronic components that areconfigured to function as one or more independent electronic systems.

As referenced herein, a single phase thermally conductive fluid isdefined as a liquid or a gas that remains in a single phase, eitherliquid or gas, across the entire range of operational temperatures andpressures of the electronic devices and/or systems disposed within thesealed enclosure.

As referenced herein, a multi-phase thermally conductive fluid isdefined as a fluid that changes phase from a liquid to a gas at atemperature and pressure within the range of operational temperaturesand pressures of the electronic devices and/or systems disposed withinthe sealed enclosure.

FIG. 1 shows a conceptual view of a sealed enclosure design comprisinginnermost enclosure wall 101 and outermost enclosure wall 103 thatenclose electronic devices 104 and a primary dielectric thermallyconductive fluid 106 in the innermost volume 150 and a secondarythermally conductive fluid 120 within the volume between the innermostenclosure wall 101 and outermost enclosure wall 103. The innermostvolume 150 contains a single phase or multi-phase primary dielectricthermally conductive fluid 106, 108 in which electronic devices 104 tobe cooled are immersed or surrounded. The single phase or multi-phaseprimary dielectric thermally conductive fluid 106, 108 may be in apredominately liquid phase, gaseous phase, or in a combination liquidphase and gaseous phase. In an embodiment that comprises a single phaseprimary dielectric thermally conductive fluid 106 in the gaseous phase,said fluid will fill the entirety of innermost volume 150. In anembodiment that comprises a single phase primary dielectric thermallyconductive fluid 106 in the liquid phase, said fluid may fill theentirety of innermost volume 150 or may fill less than the entirety ofinnermost volume 150 with the remaining volume filled by at least oneseparate and distinct fluid in the gaseous phase 108. In an embodimentthat comprises a multi-phase primary dielectric thermally conductivefluid 106, said fluid may fill the entirety of innermost volume 150 withportions of said fluid existing in the liquid phase 106 and portions ofsaid fluid existing in the gaseous phase 108 in varying proportionsrelative to the temperature, pressure, and composition of saidmulti-phase primary dielectric thermally conductive fluid 106 and ifsaid multi-phase primary dielectric thermally conductive fluid 106, 108fills less than the entirety of innermost volume 150, the remainingvolume may be filled by at least one separate and distinct fluid in thegaseous phase 108.

Embodiments of the disclosed sealed enclosure may be configured withsingle phase or multi-phase thermally conductive fluids. A single phasethermally conductive fluid will transfer heat using the principles ofconvection and conduction. A multi-phase thermally conductive fluid willtransfer heat using the principles of convection, conduction, and phasechange. As the multi-phase thermally conductive fluid in the liquidphase absorbs heat, a portion of said fluid is converted to the gaseousphase. Conversely, as the multi-phase thermally conductive fluid in thegaseous phase gives up heat by various heat exchange processes, aportion of said multi-phase thermally conductive fluid in the gaseousphase condenses back into multi-phase thermally conductive fluid in theliquid phase. If the amount of fluid in the gaseous phase 108 exceedsthe volume of space internal to the sealed enclosure that is unoccupiedby the multi-phase thermally conductive fluid in the liquid phase 106,said fluid in the gaseous phase 108 will exert a positive pressureinside the innermost volume 150 of the sealed enclosure. Conversely, ifthe amount of fluid in the gaseous phase 108 is less than the volume ofspace internal to the sealed enclosure that is unoccupied by themulti-phase thermally conductive fluid in the liquid phase 106, saidfluid in the gaseous phase 108 will exert a negative pressure inside theinnermost volume 150 of the sealed enclosure. In addition, some amountof multi-phase thermally conductive fluid in the gaseous phase 108 andoptional other distinct and suitable compressible gaseous fluid mayexist in a space of the sealed enclosure for various purposes comprisingcushioning positive and negative pressures in the sealed enclosure,maintaining a headspace in a specified range of pressure as temperaturevaries, displacing thermally conductive fluid to allow weightadjustments to the overall sealed enclosure, and/or allowingaccumulation of gaseous fluid used to drive internal kinetic processesor gaseous based mixing functionality. A single phase thermallyconductive fluid may either completely or partially fill a space of thesealed enclosure and any space in the sealed enclosure that is notfilled by said single phase thermally conductive fluid may be filledwith a distinct and suitable compressible gaseous fluid for variouspurposes comprising cushioning positive and negative pressures in thesealed enclosure, maintaining a headspace in a specified range ofpressure as temperature varies, displacing thermally conductive fluid toallow weight adjustments to the overall sealed enclosure, and/orallowing accumulation of gaseous fluid used to drive internal kineticprocesses or gaseous based mixing functionality.

The walls of the sealed enclosure are constructed with innermostenclosure wall 101 and outermost enclosure wall 103 and connected toform channels around the innermost enclosure walls 101 such that asecondary single phase or multi-phase thermally conductive fluid 120 maybe circulated within the volume contained between said enclosure wallsto an external local or remote heat exchanger assembly 130 viaconnecting lines 132, 134. In an another embodiment, the channels thatare formed around the innermost enclosure walls 101 may be constructedof conduit or piping that is thermally connected to the innermost wall101 in a path of optimal geometry such that a) a secondary single phaseor multi-phase thermally conductive fluid 120 may be circulated withinthe conduit to an external local or remote heat exchanger assembly 130via connecting lines 132, 134, and b) said conduit may be disposedbetween the innermost enclosure wall 101 and outermost enclosure wall103 or said conduit is considered to be the outermost enclosure wall103.

The secondary single phase or multi-phase thermally conductive fluid 120may be in a predominately liquid phase, gaseous phase, or in acombination liquid phase and gaseous phase. In an embodiment thatcomprises a secondary single phase thermally conductive fluid 120 in thegaseous phase or the liquid phase, said fluid may fill the entirety ofthe space between the innermost enclosure wall 101 and outermostenclosure wall 103. In an embodiment that comprises a secondarymulti-phase thermally conductive fluid 120, said fluid may partially orcompletely fill the entirety of the space between the innermostenclosure wall 101 and outermost enclosure wall 103 with portions ofsaid fluid existing in the liquid phase and portions of said fluidexisting in the gaseous phase in varying proportions relative to thetemperature, pressure, and composition of said secondary multi-phasethermally conductive fluid 120.

Electronic devices 104 may be disposed within the innermost volume 150of the sealed enclosure in a variety of configurations to facilitatethermal transfer and best practice process efficiency. The enclosedelectronic devices 104 dissipate internally generated heat into theinnermost volume 150, the primary dielectric thermally conductive fluid106, and the innermost thermally conductive walls 101 of the sealedenclosure. Heat is transported from the innermost enclosure wall 101 ofthe sealed enclosure to one or more secondary thermally conductivefluids 120 within the walls 101, 103 of the enclosure. The secondarythermally conductive fluid 120 is circulated between the walls 101, 103where heat is transferred to the secondary thermally conductive fluid120 and the outermost enclosure wall 103. The secondary thermallyconductive fluid 120 is circulated away from the sealed enclosure via afluid-tight piping connection 132, is presented to one or more heatexchanger assemblies 130 for the purpose of removing heat from thefluid, and returned to the sealed enclosure via a fluid-tight pipingconnection 134. The secondary thermally conductive fluid 120: a) iscirculated within the walls 101, 103 of the sealed enclosure whereinternal heat is absorbed; b) is removed from within the walls 101, 103of the sealed enclosure and circulated through an adjacent heat exchangeassembly 130 where a portion of the heat is removed from the thermallyconductive fluid 120; and c) is returned to within the walls 101, 103 ofthe sealed enclosure. The secondary thermally conductive fluid 120 iscirculated in such a fashion as to provide appropriate heat removal fromthe sealed enclosure. Heat exchange may be accomplished by a variety ofmeans to one or more external heat sink systems 130 that may be ofvarious types including ventilation, compression, evaporation, andgeothermal systems. The heat exchange system 130 may reject heatdirectly into the immediate environment via passive or forcedcirculation, or the fluid may be circulated away from the sealedenclosure, cooled in a remote location, and then re-circulated back tothe sealed enclosure at a lower temperature.

The innermost enclosure wall 101 is thermally conductive and isoptimized by composition and construction to provide for optimal heattransfer away from the innermost volume 150. The outermost enclosurewall 103 may thermally conductive or thermally insulating. Portions ofthe enclosure walls 103 may be optionally bonded to additional materialsthat facilitate enhanced thermal conduction or thermal insulation of theenclosure walls 103. The walls 101, 103 of the enclosure may bethermally connected by mechanical connection or other means. Coolingfins may be affixed to the wall surfaces 101, 103 to aid in heattransport and dissipation. Wall surfaces 101, 103 may have surfacefeatures of various dimensionality to aid in heat transport anddissipation. The sealed enclosure has fluid-tight entrances 110 from theoutermost surface to the innermost volume 150 for power, networking, andother control and monitoring signals and functions which areappropriately connected to one or more electronic or other functionaldevices disposed in the innermost volume 150 of the sealed enclosure.

The sealed enclosure may optionally comprise heat exchange, control,pressure balancing, fluid maintenance, and/or fluid circulationfunctionality as described in FIGS. 3, 4, 5, 6, 7. Embodiment variationsand details described herein apply equally to sealed enclosures with orwithout an interior 108 fluid head space. The sealed enclosure mayoptionally comprise one or more channels disposed in the innermostvolume 150 as described in FIGS. 15, 16. The sealed enclosure mayoptionally comprise one or more spacers disposed in the innermost volume150 of the sealed enclosure as described in FIG. 17. The sealedenclosure may optionally comprise one or more mechanisms in theinnermost volume 150 to render the electronic devices and any contentstored on those devices to be permanently unusable and unreadable asdescribed in FIG. 18.

The sealed enclosure may be located either adjacent to or remote fromany heat exchange assemblies 130 and/or pressure balancing systems andappropriate fluid transport channels between said locations are selectedbased optimal fluid flow and thermodynamic designs for the selectedfluids. Further, any heat exchange assemblies 130 and/or pressurebalancing systems may perform their indicated functions for one or moresealed enclosures. Sealed enclosures can be installed in anyorientation, placed as standalone units or stacked or grouped togetherto form a single structural unit of any dimensionality in a high-densityconfiguration.

FIG. 2 shows a conceptual view of a sealed enclosure design comprisinginnermost enclosure wall 101, intermediate enclosure wall 202, andoutermost enclosure wall 103 that enclose electronic devices 104 and aprimary dielectric thermally conductive fluid 106 in the innermostvolume 150, a secondary thermally conductive fluid 120 within the volumebetween the intermediate enclosure wall 202 and outermost enclosure wall103, and one or more secondary intermediate thermally conductive fluids222 within the volume between the innermost enclosure wall 101 andintermediate enclosure wall 202. This embodiment is illustrated with asingle intermediate enclosure wall 202 and secondary intermediatethermally conductive fluid 222, but other embodiments can containmultiple intermediate walls and fluids. The innermost volume 150contains a single phase or multi-phase dielectric thermally conductivefluid 106, 108 in which electronic devices 104 to be cooled are immersedor surrounded. The single phase or multi-phase primary dielectricthermally conductive fluid 106, 108 may be in a predominately liquidphase, gaseous phase, or in a combination liquid phase and gaseousphase. In an embodiment that comprises a single phase primary dielectricthermally conductive fluid 106 in the gaseous phase, said fluid willfill the entirety of innermost volume 150. In an embodiment thatcomprises a single phase primary dielectric thermally conductive fluid106 in the liquid phase, said fluid may fill the entirety of innermostvolume 150 or may fill less than the entirety of innermost volume 150with the remaining volume filled by at least one separate and distinctfluid in the gaseous phase 108. In an embodiment that comprises amulti-phase primary dielectric thermally conductive fluid 106, saidfluid may fill the entirety of innermost volume 150 with portions ofsaid fluid existing in the liquid phase 106 and portions of said fluidexisting in the gaseous phase 108 in varying proportions relative to thetemperature, pressure, and composition of said multi-phase primarydielectric thermally conductive fluid 106 and if said multi-phaseprimary dielectric thermally conductive fluid 106, 108 fills less thanthe entirety of innermost volume 150, the remaining volume may be filledby at least one separate and distinct fluid in the gaseous phase 108.

Embodiments of the disclosed sealed enclosure may be configured withsingle phase or multi-phase thermally conductive fluids. A single phasethermally conductive fluid will transfer heat using the principles ofconvection and conduction. A multi-phase thermally conductive fluid willtransfer heat using the principles of convection, conduction, and phasechange. As the multi-phase thermally conductive fluid in the liquidphase absorbs heat, a portion of said fluid is converted to the gaseousphase. Conversely, as the multi-phase thermally conductive fluid in thegaseous phase gives up heat by various heat exchange processes, aportion of said multi-phase thermally conductive fluid in the gaseousphase condenses back into multi-phase thermally conductive fluid in theliquid phase. If the amount of fluid in the gaseous phase 108 exceedsthe volume of space internal to the sealed enclosure that is unoccupiedby the multi-phase thermally conductive fluid in the liquid phase 106,said fluid in the gaseous phase 108 will exert a positive pressureinside the innermost volume 150 of the sealed enclosure. Conversely, ifthe amount of fluid in the gaseous phase 108 is less than the volume ofspace internal to the sealed enclosure that is unoccupied by themulti-phase thermally conductive fluid in the liquid phase 106, saidfluid in the gaseous phase 108 will exert a negative pressure inside theinnermost volume 150 of the sealed enclosure. In addition, some amountof multi-phase thermally conductive fluid in the gaseous phase 108 andoptional other distinct and suitable compressible gaseous fluid mayexist in a space of the sealed enclosure for various purposes comprisingcushioning positive and negative pressures in the sealed enclosure,maintaining a headspace in a specified range of pressure as temperaturevaries, displacing thermally conductive fluid to allow weightadjustments to the overall sealed enclosure, and/or allowingaccumulation of gaseous fluid used to drive internal kinetic processesor gaseous based mixing functionality. A single phase thermallyconductive fluid may either completely or partially fill a space of thesealed enclosure and any space in the sealed enclosure that is notfilled by said single phase thermally conductive fluid may be filledwith a distinct and suitable compressible gaseous fluid for variouspurposes comprising cushioning positive and negative pressures in thesealed enclosure, maintaining a headspace in a specified range ofpressure as temperature varies, displacing thermally conductive fluid toallow weight adjustments to the overall sealed enclosure, and/orallowing accumulation of gaseous fluid used to drive internal kineticprocesses or gaseous based mixing functionality.

In one embodiment, the walls of the sealed enclosure are constructedwith innermost enclosure wall 101, intermediate enclosure wall 202, andoutermost enclosure wall 103 and connected to form channels around theinnermost enclosure walls 101 such that additional and distinctthermally conductive fluids 222, 120 may be circulated within the volumecontained between said enclosure walls to an external local or remoteheat exchanger assembly 130, 240 via connecting lines 132, 134, 242,244. In another embodiment, remote heat exchanger assembly 240 isoptionally replaced by an embodiment that is comprised of pressurebalancing, fluid maintenance, and/or fluid circulation functionality asdescribed in FIG. 8. In an another embodiment, the channels that areformed around the innermost enclosure walls 101 may be constructed ofconduit or piping that is thermally connected to the innermost wall 101in a path of optimal geometry such that a) a secondary single phase ormulti-phase thermally conductive fluid 222 may be circulated within theconduit to an external local or remote heat exchanger assembly 240 viaconnecting lines 242, 244, and b) said conduit may be disposed betweenthe innermost enclosure wall 101 and intermediate enclosure wall 202 orsaid conduit is considered to be the intermediate enclosure wall 202. Inan another embodiment, the channels that are formed around theintermediate enclosure wall 202 may be constructed of conduit or pipingthat is thermally connected to the intermediate enclosure wall 202 in apath of optimal geometry such that a) a secondary single phase ormulti-phase thermally conductive fluid 120 may be circulated within theconduit to an external local or remote heat exchanger assembly 130 viaconnecting lines 132, 134, and b) said conduit may be disposed betweenthe intermediate enclosure wall 202 and outermost enclosure wall 103 orsaid conduit is considered to be the outermost enclosure wall 103.

The secondary intermediate single phase or multi-phase thermallyconductive fluid 222 may be in a predominately liquid phase, gaseousphase, or in a combination liquid phase and gaseous phase. In anembodiment that comprises a secondary intermediate single phasethermally conductive fluid 222 in the gaseous phase, said fluid willfill the entirety of the space between the innermost enclosure wall 101and intermediate enclosure wall 202. In an embodiment that comprises asecondary intermediate single phase thermally conductive fluid 222 inthe liquid phase, said fluid may fill the entirety of the space betweenthe innermost enclosure wall 101 and the intermediate enclosure wall 202or may fill less than the entirety of the space between the innermostenclosure wall 101 and intermediate enclosure wall 202 with theremaining volume filled by at least one separate and distinct fluid inthe gaseous phase 224. In an embodiment that comprises a secondaryintermediate multi-phase thermally conductive fluid 222, said fluid mayfill the entirety of the space between the innermost enclosure wall 101and intermediate enclosure wall 202 with portions of said fluid existingin the liquid phase 222 and portions of said fluid existing in thegaseous phase 224 in varying proportions relative to the temperature,pressure, and composition of said secondary intermediate multi-phasethermally conductive fluid 222. The secondary single phase ormulti-phase thermally conductive fluid 120 may be in a predominatelyliquid phase, gaseous phase, or in a combination liquid phase andgaseous phase. In an embodiment that comprises a secondary single phasethermally conductive fluid 120 in the gaseous phase or the liquid phase,said fluid may fill the entirety of the space between the intermediateenclosure wall 202 and outermost enclosure wall 103. In an embodimentthat comprises a secondary multi-phase thermally conductive fluid 120,said fluid may fill the entirety of the space between the intermediateenclosure wall 202 and outermost enclosure wall 103 with portions ofsaid fluid existing in the liquid phase and portions of said fluidexisting in the gaseous phase in varying proportions relative to thetemperature, pressure, and composition of said secondary multi-phasethermally conductive fluid 120.

Electronic devices 104 may be disposed within the innermost volume 150of the sealed enclosure in a variety of configurations to facilitatethermal transfer and best practice process efficiency. The enclosedelectronic devices 104 dissipate internally generated heat into theinnermost volume 150, the primary dielectric thermally conductive fluid106, and the innermost thermally conductive walls 101 of the sealedenclosure. Heat is transported from the innermost enclosure wall 101 ofthe sealed enclosure to a secondary intermediate thermally conductivefluid 222 within the walls 101, 202 of the enclosure. The secondaryintermediate thermally conductive fluid 222 may optionally be circulatedbetween the walls 101, 202 where heat is transferred to secondaryintermediate thermally conductive fluids 222 and the intermediateenclosure wall 202. The secondary intermediate thermally conductivefluid 222 may optionally be circulated away from the sealed enclosurevia a fluid-tight piping connection 242, is presented to one or moreheat exchange assemblies 240 for the purpose of removing heat from thefluid, and returned to the sealed enclosure via a fluid-tight pipingconnection 244. Heat is transported from the intermediate enclosure wall202 of the sealed enclosure to the secondary thermally conductive fluid120 within the walls 202, 103 of the enclosure. The secondary thermallyconductive fluid 120 is circulated between the walls 202, 103 where heatis transferred to the secondary thermally conductive fluid 120 and theoutermost enclosure wall 103. The secondary thermally conductive fluid120 is circulated away from the sealed enclosure via a fluid-tightpiping connection 132, is presented to one or more heat exchangeassemblies 130 for the purpose of removing heat from the fluid, andreturned to the sealed enclosure via a fluid-tight piping connection134. The secondary thermally conductive fluid 120: a) is circulatedwithin the walls 103, 202 of the sealed enclosure where internal heat isabsorbed; b) is removed from within the walls 103, 202 of the sealedenclosure and circulated through an adjacent heat exchange assembly 130where a portion of the heat is removed from the thermally conductivefluid 120; and c) is returned to within the walls 103, 202 of the sealedenclosure. The secondary thermally conductive fluid 120 is circulated insuch a fashion as to provide appropriate heat removal from the sealedenclosure. In the case of a sealed enclosure with one or moreintermediate enclosure walls 202, each secondary intermediate thermallyconductive fluid 222 may optionally be circulated from the sealedenclosure to an associated intermediate heat exchanger assembly 240.Further, if a sealed enclosure embodiment comprises both a secondarythermally conductive fluid 120 and one or more secondary intermediatethermally conductive fluids 222, then at least one of the said thermallyconductive fluids is removed from the sealed enclosure, circulatedthrough a heat exchanger assembly, and returned to the sealed enclosure.Heat exchange may be accomplished by a variety of means to one or moreexternal heat sink systems 130, 240 that may be of various typesincluding ventilation, compression, evaporation, absorption, andgeothermal systems. The heat exchange system 130, 240 may reject heatdirectly into the immediate environment of the sealed enclosure viapassive or forced circulation, or the fluid may be circulated away fromthe sealed enclosure, cooled in a remote location, and thenre-circulated back to the sealed enclosure at a lower temperature.

The innermost enclosure wall 101 and intermediate enclosure wall 202 arethermally conductive and are optimized by composition and constructionto provide for optimal heat transfer away from the innermost volume 150.The outermost enclosure wall 103 may thermally conductive or thermallyinsulating. Portions of the enclosure walls 103 may be optionally bondedto additional materials that facilitate enhanced thermal conduction orthermal insulation of the enclosure walls 103. The walls 101, 202, 103of the enclosure may be thermally connected by mechanical connection orother means. Cooling fins may be affixed to the wall surfaces 101, 202,103 to aid in heat transport and dissipation. Wall surfaces 101, 102,103 may have surface features of various dimensionality to aid in heattransport and dissipation. The sealed enclosure has fluid-tightentrances 110 from the outermost surface to the innermost volume 150 forpower, networking, and other control and monitoring signals andfunctions which are appropriately connected to one or more electronic orother functional devices disposed in the innermost volume 150 of thesealed enclosure.

The multi-wall sealed enclosure described herein may optionally compriseheat exchange, control, pressure balancing, fluid maintenance, and/orfluid circulation functionality as described in FIGS. 3, 4, 5, 6, 7 inwhich the innermost enclosure wall 101 and outermost enclosure wall 103describe optional functionality without reference to the intermediateenclosure wall 202. Further, the multi-wall sealed enclosure describedherein may optionally comprise heat exchange, control, pressurebalancing, fluid maintenance, and/or fluid circulation functionality asdescribed in FIG. 8. Embodiment variations and details described hereinapply equally to sealed enclosures with or without intermediateenclosure walls 202 and secondary intermediate thermally conductivefluids 222, and with or without an interior 108, 224 fluid head space.The sealed enclosure may optionally comprise one or more channelsdisposed in the innermost volume 150 as described in FIGS. 15, 16. Thesealed enclosure may optionally comprise one or more spacers disposed inthe innermost volume 150 of the sealed enclosure as described in FIG.17. The sealed enclosure may optionally comprise one or more mechanismsin the innermost volume 150 to render the electronic devices and anycontent stored on those devices to be permanently unusable andunreadable as described in FIG. 18.

The sealed enclosure may be located either adjacent to or remote fromany heat exchange assemblies 130, 240 and/or pressure balancing systemsand appropriate fluid transport channels between said locations areselected based optimal fluid flow and thermodynamic designs for theselected fluids. Further, any heat exchange assemblies 130, 240 and/orpressure balancing systems may perform their indicated functions for oneor more sealed enclosures. Sealed enclosures can be installed in anyorientation, placed as standalone units or stacked or grouped togetherto form a single structural unit of any dimensionality in a high-densityconfiguration.

FIG. 3 shows a conceptual view of a single port pressure balancingmechanism used to relieve positive and negative pressures in a sealedenclosure, optional heat exchange mechanisms, and optional primarydielectric thermally conductive fluid pump circulation mechanisms. Thesealed enclosure shown in the figure is typical of the disclosuresdescribed in FIGS. 1, 2 and is illustrated by showing only a portion ofsuch sealed enclosure as a figure with an innermost enclosure wall 101and an outermost enclosure wall 103, wherein the innermost volumecontains the primary dielectric thermally conductive fluid 106, 108 thateither completely or partially fills the interior of the sealedenclosure as shown.

The fluid exchange sealed entrance assembly 302 allows primarydielectric thermally conductive fluid 106, 108 fluid to be exchangedbetween the sealed enclosure and a pressure balancing system 304,maintaining a sealed enclosure environment and functioning for thepurpose of pressure equalization of the innermost volume 150 of thesealed enclosure and providing optional fluid management. The fluidexchange sealed entrance assembly 302 and pressure balancing system 304may be configured to function with any primary dielectric thermallyconductive fluid, but is used advantageously in embodiments that containa) a single phase primary dielectric thermally conductive fluid 106 inthe liquid phase, said fluid filling less than the entirety of innermostvolume 150 with the remaining volume filled by at least one separate anddistinct fluid in the gaseous phase 108, b) a single phase thermallyconductive fluid 106 in the gaseous phase, said fluid filling theentirety of innermost volume 150, or c) a multi-phase primary dielectricthermally conductive fluid 106, said fluid at least partially fillingthe innermost volume 150 with portions of said fluid existing in theliquid phase 106 and portions of said fluid existing in the gaseousphase 108 in varying proportions relative to the temperature, pressure,and composition of said multi-phase primary dielectric thermallyconductive fluid 106 and if said multi-phase primary dielectricthermally conductive fluid 106, 108 fills less than the entirety ofinnermost volume 150, the remaining volume may be filled by at least oneseparate and distinct fluid in the gaseous phase 108.

The pressure balancing system 304 is an adjacently located or remotesystem that functions to maintain a suitably constant fluid presence andpressure to the fluid exchange sealed entrance assembly 302 for one ormore sealed enclosures. The pressure balancing system 304 is capable ofsupplying pressure to or removing pressure from the sealed enclosureusing a single fluid exchange sealed entrance assembly 302 viaconnecting lines.

An extended surface configuration of the fluid exchange sealed entranceassembly 302 may be positioned either inside or outside of the sealedenclosure and is comprised of thermally conductive materials configuredan extended surface area to effect supplement heat removal from theprimary dielectric thermally conductive fluid 106, 108 that istransported through the fluid exchange sealed entrance assembly 302.Such extended surface configuration of the fluid exchange sealedentrance assembly 302 is cooled by the secondary thermally conductivefluid 120 that is returned from the secondary fluid heat exchanger 130via connecting line 134 and flows over the extended surfaceconfiguration of the fluid exchange sealed entrance assembly 302. Theflow of cooled secondary thermally conductive fluid 120 over theextended surface configuration of the fluid exchange sealed entranceassembly 302 serves to remove heat from the primary dielectric thermallyconductive fluid 106, 108 that is transported through the fluid exchangesealed entrance assembly 302. This extended surface configuration of thefluid exchange sealed entrance assembly 302 may be utilized to condensethe multi-phase primary dielectric thermally conductive fluid from thegaseous phase 108 back into the liquid phase 106, with the result ofreturning the multi-phase primary dielectric thermally conductive fluid106 in the liquid phase back into the sealed enclosure by gravity flowor other mechanical means in order to maintain a proper amount ofprimary dielectric thermally conductive fluid 106 within the sealedenclosure.

One or more optional heat exchange mechanisms 320 may be disposed withinthe innermost volume 150 such that a secondary single phase ormulti-phase thermally conductive fluid 120 is segregated from theprimary dielectric thermally conductive fluid 106, 108 and may becirculated through heat exchange mechanism 320 to an external local orremote heat exchanger assembly 130 via connecting lines 132, 134. Heatexchange mechanisms 320 are disposed within the primary dielectricthermally conductive fluid liquid phase 106 and/or the gaseous phase 108as heat exchange mechanisms comprising concentric tube, shell and tube,plate, fin, plate-fin, tube-fin, condenser tubing, loops, and split-flowloops. Heat exchange mechanisms 320 may be thermally and/or mechanicallyattached or isolated from the innermost enclosure wall 101. Heatexchange mechanisms 320 may be thermally and/or mechanically connectedto portions of the enclosed electronic devices 104.

Optional mechanisms may be additionally configured in the innermostvolume 150 of the sealed enclosure in order to effect the circulation ofthe primary dielectric thermally conductive fluid 106 for the purpose ofa) circulating the primary dielectric thermally conductive fluid 106 inorder to more effectively transfer thermal energy from the enclosedelectronic devices 104 to the primary dielectric thermally conductivefluid 106 and the innermost enclosure wall 101, and b) to circulate theprimary dielectric thermally conductive fluid 106 through at least onefilter to trap impurities and particulates, embodiments of suchmechanisms comprise a) a mechanism comprised of a fluid pump 310, a pumpintake 312, and a pump discharge 314, or b) a mechanism comprised of animpeller, fan, turbine, or propeller that rotates under motive force.

FIG. 4 shows a conceptual view of a dual port pressure balancingmechanism used to relieve positive and negative pressures in a sealedenclosure, optional heat exchange mechanisms, and optional primarydielectric thermally conductive fluid pump circulation mechanisms. Thesealed enclosure shown in the figure is typical of the disclosuresdescribed in FIGS. 1, 2 and is illustrated by showing only a portion ofsuch sealed enclosure as a figure with an innermost enclosure wall 101and an outermost enclosure wall 103, wherein the innermost volumecontains the primary dielectric thermally conductive fluid 106, 108 thateither completely or partially fills the interior of the sealedenclosure as shown.

The fluid exchange sealed entrance assembly 408 and fluid exchangesealed exhaust assembly 406 work in concert to allow primary dielectricthermally conductive fluid 106, 108 fluid to be exchanged between thesealed enclosure and a pressure balancing system 304, maintaining asealed enclosure environment and functioning for the purpose of pressureequalization of the innermost volume 150 of the sealed enclosure andproviding optional fluid management. The fluid exchange sealed entranceassembly 408, fluid exchange sealed exhaust assembly 406, and pressurebalancing system 304 may be configured to function with any primarydielectric thermally conductive fluid, but is used advantageously in theembodiments that contain a) a single phase primary dielectric thermallyconductive fluid 106 in the liquid phase, said fluid filling less thanthe entirety of innermost volume 150 with the remaining volume filled byat least one separate and distinct fluid in the gaseous phase 108, b) asingle phase thermally conductive fluid 106 in the gaseous phase, saidfluid filling the entirety of innermost volume 150, or c) a multi-phaseprimary dielectric thermally conductive fluid 106, said fluid at leastpartially filling the innermost volume 150 with portions of said fluidexisting in the liquid phase 106 and portions of said fluid existing inthe gaseous phase 108 in varying proportions relative to thetemperature, pressure, and composition of said multi-phase primarydielectric thermally conductive fluid 106 and if said multi-phaseprimary dielectric thermally conductive fluid 106, 108 fills less thanthe entirety of innermost volume 150, the remaining volume may be filledby at least one separate and distinct fluid in the gaseous phase 108.

The pressure balancing system 304 is closed loop system that is anadjacently located or remote system that functions to maintain anappropriate fluid presence and pressure at the fluid exchange sealedentrance assembly 408 and the fluid exchange sealed exhaust assembly 406for one or more sealed enclosures via connecting lines. The pressurebalancing system 304 is capable of supplying fluid pressure to theinnermost volume 150 of the sealed enclosure using the fluid exchangesealed entrance assembly 408 via connecting lines. The fluid exchangesealed entrance assembly 408 may be configured with a pressure reliefvalve assembly that allows fluid pressure to be released from thepressure balancing system 304 into the innermost volume 150 of thesealed enclosure when the fluid pressure in the innermost volume 150 ofthe sealed enclosure falls below a specified value thereby raising thefluid pressure in the innermost volume 150 of the sealed enclosure. Thefluid exchange sealed entrance assembly 408 may be optionally configuredwith a pressure regulator allowing the pressure balancing system 304 todistribute a high fluid pressure to said pressure regulator whichreduces the fluid pressure to appropriate fluid pressure level forproper pressure relief valve operation. The fluid exchange sealedentrance assembly 408 may be located either inside or outside the sealedenclosure.

The pressure balancing system 304 is capable of removing fluid pressurefrom the innermost volume 150 of the sealed enclosure using the fluidexchange sealed exhaust assembly 406 via connecting lines. The fluidexchange sealed exhaust assembly 406 may be configured with a pressurerelief valve assembly that allows fluid pressure to be released frominnermost volume 150 of the sealed enclosure into the fluid pressurecollection functionality of the pressure balancing system 304 when thefluid pressure in the innermost volume 150 of the sealed enclosure risesabove a specified value thereby lowering the fluid pressure in theinnermost volume 150 of the sealed enclosure. The fluid exchange sealedexhaust assembly 406 may be located either inside or outside the sealedenclosure.

An extended surface configuration of the fluid exchange sealed exhaustassembly 406 may be positioned either inside or outside of the sealedenclosure and is comprised of thermally conductive materials configuredan extended surface area to effect supplement heat removal from theprimary dielectric thermally conductive fluid 106, 108 that istransported through the fluid exchange sealed exhaust assembly 406. Suchextended surface configuration of the fluid exchange sealed exhaustassembly 406 is cooled by the secondary thermally conductive fluid 120that is returned from the secondary fluid heat exchanger 130 viaconnecting line 134 and flows over the extended surface configuration ofthe fluid exchange sealed exhaust assembly 406. The flow of cooledsecondary thermally conductive fluid 120 over the extended surfaceconfiguration of the fluid exchange sealed exhaust assembly 406 servesto remove heat from the primary dielectric thermally conductive fluid106, 108 that is transported through the fluid exchange sealed exhaustassembly 406. This extended surface configuration of the fluid exchangesealed exhaust assembly 406 may be utilized to condense multi-phaseprimary dielectric thermally conductive fluid from the gaseous phase 108back into the liquid phase 106, with the result of returning suchmulti-phase primary dielectric thermally conductive fluid 106 in theliquid phase back into the sealed enclosure by gravity flow or othermechanical means in order to maintain a proper amount of primarydielectric thermally conductive fluid 106 within the sealed enclosure.

One or more optional heat exchange mechanisms 320 may be disposed withinthe innermost volume 150 such that a secondary single phase ormulti-phase thermally conductive fluid 120 is segregated from theprimary dielectric thermally conductive fluid 106, 108 and may becirculated through heat exchange mechanism 320 to an external local orremote heat exchanger assembly 130 via connecting lines 132, 134. Heatexchange mechanisms 320 are disposed within the primary dielectricthermally conductive fluid liquid phase 106 and/or the gaseous phase 108as heat exchange mechanisms comprising concentric tube, shell and tube,plate, fin, plate-fin, tube-fin, condenser tubing, loops, and split-flowloops. Heat exchange mechanisms 320 may be thermally and/or mechanicallyattached or isolated from the innermost enclosure wall 101. Heatexchange mechanisms 320 may be thermally and/or mechanically connectedto portions of the enclosed electronic devices 104.

Optional mechanisms may be additionally configured in the innermostvolume 150 of the sealed enclosure in order to effect the circulation ofthe primary dielectric thermally conductive fluid 106 for the purpose ofa) circulating the primary dielectric thermally conductive fluid 106 inorder to more effectively transfer thermal energy from the enclosedelectronic devices 104 to the primary dielectric thermally conductivefluid 106 and the innermost enclosure wall 101, and b) to circulate theprimary dielectric thermally conductive fluid 106 through at least onefilter to trap impurities and particulates, embodiments of suchmechanisms comprise a) a mechanism comprised of a fluid pump 310, a pumpintake 312, and a pump discharge 314, or b) a mechanism comprised of animpeller, fan, turbine, or propeller that rotates under motive force.

FIG. 5 shows a conceptual view of a dual port pressure balancingmechanism used to relieve positive and negative pressures in a sealedenclosure, optional heat exchange mechanisms, and optional pressurizedgaseous fluid driven primary dielectric thermally conductive fluid pumpand bubbler circulation mechanisms. The sealed enclosure shown in thefigure is typical of the disclosures described in FIGS. 1, 2 and isillustrated by showing only a portion of such sealed enclosure as afigure with an innermost enclosure wall 101 and an outermost enclosurewall 103, wherein the innermost volume contains the primary dielectricthermally conductive fluid 106, 108 that either completely or partiallyfills the interior of the sealed enclosure as shown.

The fluid exchange sealed entrance assembly 408 and the fluid exchangesealed exhaust assembly 406 work in concert to allow primary dielectricthermally conductive fluid 106, 108 fluid to be exchanged between thesealed enclosure and a pressure balancing system 304, maintaining asealed enclosure environment and functioning for the purpose of pressureequalization of the innermost volume 150 of the sealed enclosure,providing optional fluid management, and providing optional motive forceto kinetic processes located in the innermost volume 150 of the sealedenclosure. The fluid exchange sealed entrance assembly 408, fluidexchange sealed exhaust assembly 406, and pressure balancing system 304may be configured to function with any primary dielectric thermallyconductive fluid, but is used advantageously in the embodiments thatcontain a) a single phase primary dielectric thermally conductive fluid106 in the liquid phase, said fluid filling less than the entirety ofinnermost volume 150 with the remaining volume filled by at least oneseparate and distinct fluid in the gaseous phase 108, b) a single phasethermally conductive fluid 106 in the gaseous phase, said fluid fillingthe entirety of innermost volume 150, or c) a multi-phase primarydielectric thermally conductive fluid 106, said fluid at least partiallyfilling the innermost volume 150 with portions of said fluid existing inthe liquid phase 106 and portions of said fluid existing in the gaseousphase 108 in varying proportions relative to the temperature, pressure,and composition of said multi-phase primary dielectric thermallyconductive fluid 106 and if said multi-phase primary dielectricthermally conductive fluid 106, 108 fills less than the entirety ofinnermost volume 150, the remaining volume may be filled by at least oneseparate and distinct fluid in the gaseous phase 108.

The pressure balancing system 304 is closed loop system that is anadjacently located or remote system that functions to maintain anappropriate fluid presence and pressure at the fluid exchange sealedentrance assembly 408 and the fluid exchange sealed exhaust assembly 406for one or more sealed enclosures via connecting lines. The pressurebalancing system 304 is capable of supplying fluid pressure to theinnermost volume 150 of the sealed enclosure using the fluid exchangesealed entrance assembly 408 via connecting lines. The fluid exchangesealed entrance assembly 408 may be configured with a pressure reliefvalve assembly that allows fluid pressure to be released from thepressure balancing system 304 into the innermost volume 150 of thesealed enclosure when the fluid pressure in the innermost volume 150 ofthe sealed enclosure falls below a specified value thereby raising thefluid pressure in the innermost volume 150 of the sealed enclosure. Thefluid exchange sealed entrance assembly 408 may be optionally configuredwith a pressure regulator allowing the pressure balancing system 304 todistribute a high fluid pressure to said pressure regulator whichreduces the fluid pressure to appropriate fluid pressure level forproper pressure relief valve operation. The fluid exchange sealedentrance assembly 408 may be located either inside or outside the sealedenclosure.

The pressure balancing system 304 is capable of removing fluid pressurefrom the innermost volume 150 of the sealed enclosure using the fluidexchange sealed exhaust assembly 406 via connecting lines. The fluidexchange sealed exhaust assembly 406 may be configured with a pressurerelief valve assembly that allows fluid pressure to be released frominnermost volume 150 of the sealed enclosure into the fluid pressurecollection functionality of the pressure balancing system 304 when thefluid pressure in the innermost volume 150 of the sealed enclosure risesabove a specified value thereby lowering the fluid pressure in theinnermost volume 150 of the sealed enclosure. The fluid exchange sealedexhaust assembly 406 may be located either inside or outside the sealedenclosure.

An extended surface configuration of the fluid exchange sealed exhaustassembly 406 may be positioned either inside or outside of the sealedenclosure and is comprised of thermally conductive materials configuredan extended surface area to effect supplement heat removal from theprimary dielectric thermally conductive fluid 106, 108 that istransported through the fluid exchange sealed exhaust assembly 406. Suchextended surface configuration of the fluid exchange sealed exhaustassembly 406 is cooled by the secondary thermally conductive fluid 120that is returned from the secondary fluid heat exchanger 130 viaconnecting line 134 and flows over the extended surface configuration ofthe fluid exchange sealed exhaust assembly 406. The flow of cooledsecondary thermally conductive fluid 120 over the extended surfaceconfiguration of the fluid exchange sealed exhaust assembly 406 servesto remove heat from the primary dielectric thermally conductive fluid106, 108 that is transported through the fluid exchange sealed exhaustassembly 406. This extended surface configuration of the fluid exchangesealed exhaust assembly 406 may be utilized to condense multi-phaseprimary dielectric thermally conductive fluid from the gaseous phase 108back into the liquid phase 106, with the result of returning suchmulti-phase primary dielectric thermally conductive fluid 106 in theliquid phase back into the sealed enclosure by gravity flow or othermechanical means in order to maintain a proper amount of primarydielectric thermally conductive fluid 106 within the sealed enclosure.

One or more optional heat exchange mechanisms 320 may be disposed withinthe innermost volume 150 such that a secondary single phase ormulti-phase thermally conductive fluid 120 is segregated from theprimary dielectric thermally conductive fluid 106, 108 and may becirculated through heat exchange mechanism 320 to an external local orremote heat exchanger assembly 130 via connecting lines 132, 134. Heatexchange mechanisms 320 are disposed within the primary dielectricthermally conductive fluid liquid phase 106 and/or the gaseous phase 108as heat exchange mechanisms comprising concentric tube, shell and tube,plate, fin, plate-fin, tube-fin, condenser tubing, loops, and split-flowloops. Heat exchange mechanisms 320 may be thermally and/or mechanicallyattached or isolated from the innermost enclosure wall 101. Heatexchange mechanisms 320 may be thermally and/or mechanically connectedto portions of the enclosed electronic devices 104.

An optional mechanism may be additionally configured in the innermostvolume 150 of the sealed enclosure in order to effect the circulation ofthe primary dielectric thermally conductive fluid 106 by using fluidpressure to supply the motive force for optional kinetic processes thatinclude a) fluid circulation by means of a fluid pressure driven pump502, b) fluid circulation by means of a bubbler 506, c) fluidcirculation by means of both a fluid pressure driven pump 502 and abubbler 506, or d) other fluid circulation mechanisms. These optionalmotive force mechanisms are driven by pressured fluid supplied by thepressure balancing system 304 to the motive force sealed entranceassembly 504 via connecting lines. The motive force sealed entranceassembly 504 may be optionally configured with a pressure regulatorallowing the motive force fluid pressure source to supply a highpressure fluid to said pressure regulator which reduces the fluidpressure to appropriate fluid pressure level for the proper operation ofthe fluid pressure driven kinetic processes. The motive force sealedentrance assembly 504 may be configured with a pressure control valveassembly that allows fluid pressure from the pressure balancing system304 to be turned on or off, thereby supplying fluid pressure from thepressure balancing system 304 to kinetic processes such as the fluidpressure driven pump 502 and/or the bubbler 506 for the purpose of a)circulating the primary dielectric thermally conductive fluid 106 inorder to more effectively transfer thermal energy from the enclosedelectronic devices 104 to the primary dielectric thermally conductivefluid 106 and the innermost enclosure wall 101, and b) to circulate theprimary dielectric thermally conductive fluid 106 through at least onefilter to trap impurities and particulates. Fluid pressure supplied bythe pressure balancing system 304 into the innermost volume 150 of thesealed enclosure via the exhaust of the fluid pressure driven pump 502and/or the bubbler 506 is returned to the pressure balancing system 304through the fluid exchange sealed exhaust assembly 406. Embodiments thatcirculate the primary dielectric thermally conductive fluid 106 via apumping action are comprised of a fluid pressure driven pump 502connected to the motive force sealed entrance assembly 504, a pumpintake 312, and a pump discharge 314. Embodiments that circulate theprimary dielectric thermally conductive fluid 106 via a bubbling actionare comprised of a bubbler 506 connected to the motive force sealedentrance assembly 504, and a bubbler connecting line 508, said bubbler506 located in the lower part of the innermost volume 150 of the sealedenclosure and comprising a mechanical means of releasing a pressuredfluid in a predominately gaseous phase via a number of bubbler pores ofvarious sizes. If the bubbler 506 and the fluid pressure driven pump 502are both configured in an embodiment, the fluid pressure utilized todrive the bubbler 506 is supplied by the discharge fluid pressure of thefluid pressure driven pump 502 via connection lines 508. The motiveforce sealed entrance assembly 504 may be located either inside oroutside the sealed enclosure.

FIG. 6 shows a conceptual view of an internal pressure balancingmechanism with optional dual port pressure balancing mechanism used torelieve positive and negative pressures in a sealed enclosure, optionalheat exchange mechanisms, and optional primary dielectric thermallyconductive fluid pump circulation mechanisms. The sealed enclosure shownin the figure is typical of the disclosures described herein FIGS. 1, 2and is illustrated by showing only a portion of such sealed enclosure asa figure with an innermost enclosure wall 101 and an outermost enclosurewall 103, wherein the innermost volume contains the primary dielectricthermally conductive fluid 106, 108 that either completely or partiallyfills the interior of the sealed enclosure as shown.

Pressure equalization of the innermost volume 150 of the sealedenclosure as well as optional fluid management is provided by a) one ormore first mechanisms disclosed as an internal pressure balancingmechanism and comprised of gaseous fluid compressor 602, pressurizedgaseous fluid storage 604, gaseous fluid entrance assembly 606, gaseousand condensed fluid exhaust assembly 608, and associated connectinglines, valves, sensors, controls, wiring, power, enclosures, andregulators, and b) an optional second mechanism comprised of fluidexchange sealed entrance assembly 408, fluid exchange sealed exhaustassembly 406, pressure balancing system 304, and associated connectinglines, valves, sensors, controls, wiring, power, enclosures, andregulators such that if said first mechanisms and said second mechanismare present in an embodiment, one of the said mechanisms may bedesignated as the primary functional mechanism while the remaining saidmechanisms are designated as secondary functional mechanisms, or all ofthe said mechanisms may be designated as the primary functionalmechanisms. The gaseous fluid compressor 602, pressurized gaseous fluidstorage 604, gaseous fluid entrance assembly 606, gaseous and condensedfluid exhaust assembly 608, and/or fluid exchange sealed entranceassembly 408, fluid exchange sealed exhaust assembly 406, and pressurebalancing system 304 may be configured to function with any primarydielectric thermally conductive fluid, but is used advantageously in theembodiments that contain a) single phase primary dielectric thermallyconductive fluid 106 in the liquid phase, said fluid filling less thanthe entirety of innermost volume 150 with the remaining volume filled byat least one separate and distinct fluid in the gaseous phase 108, b)single phase thermally conductive fluid 106 in the gaseous phase, saidfluid filling the entirety of innermost volume 150, or c) multi-phaseprimary dielectric thermally conductive fluid 106, said fluid at leastpartially filling the innermost volume 150 with portions of said fluidexisting in the liquid phase 106 and portions of said fluid existing inthe gaseous phase 108 in varying proportions relative to thetemperature, pressure, and composition of said multi-phase primarydielectric thermally conductive fluid 106 and if said multi-phaseprimary dielectric thermally conductive fluid 106, 108 fills less thanthe entirety of innermost volume 150, the remaining volume may be filledby at least one separate and distinct fluid in the gaseous phase 108.

The gaseous fluid compressor 602, pressurized gaseous fluid storage 604,gaseous fluid entrance assembly 606, and gaseous and condensed fluidexhaust assembly 608 work in concert to allow gaseous fluid that ispresent in the innermost volume 150 of the sealed enclosure to becompressed and stored for release back into the innermost volume 150 ofthe sealed enclosure as necessary to maintain a specified range of fluidpressure within the innermost volume 150 of the sealed enclosure. Thegaseous fluid entrance assembly 606 may comprise a a) check valve thatallows only fluid in the gaseous phase to flow into the intake of thegaseous fluid compressor 602, or b) pressure relief valve that allowspressure to be a specified amount greater in innermost volume 150 thanthe pressure in the intake of the gaseous fluid compressor 602. When thefluid pressure in the innermost volume 150 of the sealed enclosure risesabove a specified value, the gaseous fluid compressor 602 is activatedand gaseous fluid 108 flows through the gaseous fluid entrance assembly606 into the intake of the gaseous fluid compressor 602 where suchgaseous fluid is compressed by the gaseous fluid compressor 602 andstored in pressurized gaseous fluid storage 604 thereby lowering thefluid pressure in the innermost volume 150 of the sealed enclosure.

The pressurized gaseous fluid storage 604 may be comprised of thermallyconductive materials configured to effect supplemental heat removal fromthe compressed gaseous fluid 108 by configurations comprisingconstruction methodology or optional heat exchanger 610. In embodimentswith multi-phase thermally conductive fluid, as heat is removed from themulti-phase thermally conductive fluid 108 disposed inside thepressurized gaseous fluid storage 604, at least a portion of themulti-phase thermally conductive fluid 108 in the gaseous phasecondenses to liquid phase 106 and flows as a liquid to the lower part ofpressurized gaseous fluid storage 604 thereby reducing the pressureinside the pressurized gaseous fluid storage 604 as an effect of saidphase change of the multi-phase thermally conductive fluid from thegaseous phase 108 to the liquid phase 106.

The gaseous and condensed fluid exhaust assembly 608 is comprised of apressure regulator and a controllable pressure relief valve as to allowfluid 106, 108 in gaseous and/or liquid phase that is disposed in thepressurized gaseous fluid storage 604 to be discharged into theinnermost volume 150 when conditions exist such as a) a specific commandto act is issued by control systems, b) pressure in innermost volume 150falls below a specified value, c) a sensor internal to the pressurizedgaseous fluid storage 604 detects a liquid condensation level abovespecified value, d) a required operation prior to the operation of thegaseous fluid compressor 602, e) after powering up or before poweringdown the system of electronic devices 104, or f) other conditions asrequired by safety or operational status with said discharge actioncontinuing until such time as a) a sensor internal to the pressurizedgaseous fluid storage 604 detects a liquid condensation level belowspecified value, b) pressure in the innermost volume 150 rise above aspecified value, or c) other conditions as required by safety oroperational status.

An optional heat exchanger 610 comprising a concentric tube, shell andtube, plate, fin, plate-fin, or tube-fin heat exchanger removes heatfrom pressurized gaseous fluid storage 604. The pressurized gaseousfluid storage 604 may be comprised of thermally conductive materialsconfigured to effect supplemental heat removal from the fluid 108 thatis disposed internally to the pressurized gaseous fluid storage 604. Theheat exchanger 610 may be positioned partially or completely inside oroutside of the sealed enclosure. The pressurized gaseous fluid storage604 is cooled by the secondary thermally conductive fluid 120 that isreturned from the secondary fluid heat exchanger 130 via connecting line134 and flows through the heat exchanger 610. In embodiments withmulti-phase thermally conductive fluid, the cooled pressurized gaseousfluid storage 604 serves to remove heat from the multi-phase thermallyconductive fluid 108 that is confined in the pressurized gaseous fluidstorage 604 which may further serve to condense multi-phase thermallyconductive fluid from the gaseous phase 108 into the liquid phase 106 ofsaid fluid, thereby reducing the pressure inside the pressurized gaseousfluid storage 604 as an effect of said phase change of the multi-phasethermally conductive fluid from the gaseous phase 108 to the liquidphase 106.

The fluid exchange sealed entrance assembly 408 and the fluid exchangesealed exhaust assembly 406 work in concert to allow primary dielectricthermally conductive fluid 106, 108 fluid to be exchanged between thesealed enclosure and a pressure balancing system 304, maintaining asealed enclosure environment. The pressure balancing system 304 isclosed loop system that is an adjacently located or remote system thatfunctions to maintain an appropriate fluid presence and pressure at thefluid exchange sealed entrance assembly 408 and the fluid exchangesealed exhaust assembly 406 for one or more sealed enclosures viaconnecting lines. The pressure balancing system 304 is capable ofsupplying fluid pressure to the innermost volume 150 of the sealedenclosure using the fluid exchange sealed entrance assembly 408 viaconnecting lines. The fluid exchange sealed entrance assembly 408 may beconfigured with a pressure relief valve assembly that allows fluidpressure to be released from the pressure balancing system 304 into theinnermost volume 150 of the sealed enclosure when the fluid pressure inthe innermost volume 150 of the sealed enclosure falls below a specifiedvalue thereby raising the fluid pressure in the innermost volume 150 ofthe sealed enclosure. The fluid exchange sealed entrance assembly 408may be optionally configured with a pressure regulator allowing thepressure balancing system 304 to distribute a high fluid pressure tosaid pressure regulator which reduces the fluid pressure to appropriatefluid pressure level for proper pressure relief valve operation. Thefluid exchange sealed entrance assembly 408 may be located either insideor outside the sealed enclosure.

The pressure balancing system 304 is capable of removing fluid pressurefrom the innermost volume 150 of the sealed enclosure using the fluidexchange sealed exhaust assembly 406 via connecting lines. The fluidexchange sealed exhaust assembly 406 may be configured with a pressurerelief valve assembly that allows fluid pressure to be released frominnermost volume 150 of the sealed enclosure into the fluid pressurecollection functionality of the pressure balancing system 304 when thefluid pressure in the innermost volume 150 of the sealed enclosure risesabove a specified value thereby lowering the fluid pressure in theinnermost volume 150 of the sealed enclosure. The fluid exchange sealedexhaust assembly 406 may be located either inside or outside the sealedenclosure.

An extended surface configuration of the fluid exchange sealed exhaustassembly 406 may be positioned either inside or outside of the sealedenclosure and is comprised of thermally conductive materials configuredan extended surface area to effect supplement heat removal from theprimary dielectric thermally conductive fluid 106, 108 that istransported through the fluid exchange sealed exhaust assembly 406. Suchextended surface configuration of the fluid exchange sealed exhaustassembly 406 is cooled by the secondary thermally conductive fluid 120that is returned from the secondary fluid heat exchanger 130 viaconnecting line 134 and flows over the extended surface configuration ofthe fluid exchange sealed exhaust assembly 406. The flow of cooledsecondary thermally conductive fluid 120 over the extended surfaceconfiguration of the fluid exchange sealed exhaust assembly 406 servesto remove heat from the primary dielectric thermally conductive fluid106, 108 that is transported through the fluid exchange sealed exhaustassembly 406. This extended surface configuration of the fluid exchangesealed exhaust assembly 406 may be utilized to condense multi-phaseprimary dielectric thermally conductive fluid from the gaseous phase 108back into the liquid phase 106, with the result of returning suchmulti-phase primary dielectric thermally conductive fluid 106 in theliquid phase back into the sealed enclosure by gravity flow or othermechanical means in order to maintain a proper amount of primarydielectric thermally conductive fluid 106 within the sealed enclosure.

One or more optional heat exchange mechanisms 320 may be disposed withinthe innermost volume 150 such that a secondary single phase ormulti-phase thermally conductive fluid 120 is segregated from theprimary dielectric thermally conductive fluid 106, 108 and may becirculated through heat exchange mechanism 320 to an external local orremote heat exchanger assembly 130 via connecting lines 132, 134. Heatexchange mechanisms 320 are disposed within the primary dielectricthermally conductive fluid liquid phase 106 and/or the gaseous phase 108as heat exchange mechanisms comprising concentric tube, shell and tube,plate, fin, plate-fin, tube-fin, condenser tubing, loops, and split-flowloops. Heat exchange mechanisms 320 may be thermally and/or mechanicallyattached or isolated from the innermost enclosure wall 101. Heatexchange mechanisms 320 may be thermally and/or mechanically connectedto portions of the enclosed electronic devices 104.

Optional mechanisms may be additionally configured in the innermostvolume 150 of the sealed enclosure in order to effect the circulation ofthe primary dielectric thermally conductive fluid 106 for the purpose ofa) circulating the primary dielectric thermally conductive fluid 106 inorder to more effectively transfer thermal energy from the enclosedelectronic devices 104 to the primary dielectric thermally conductivefluid 106 and the innermost enclosure wall 101, and b) to circulate theprimary dielectric thermally conductive fluid 106 through at least onefilter to trap impurities and particulates, embodiments of suchmechanisms comprise a) a mechanism comprised of a fluid pump 310, a pumpintake 312, and a pump discharge 314, or b) a mechanism comprised of animpeller, fan, turbine, or propeller that rotates under motive force.

FIG. 7 shows a conceptual view of an internal pressure balancingmechanism with dual port pressure balancing mechanism used to relievepositive and negative pressures in a sealed enclosure, optional heatexchange mechanisms, and optional pressurized gaseous fluid drivenprimary dielectric thermally conductive fluid pump and bubblercirculation mechanisms. The sealed enclosure shown in the figure istypical of the disclosures described herein FIGS. 1, 2 and isillustrated by showing only a portion of such sealed enclosure as afigure with an innermost enclosure wall 101 and an outermost enclosurewall 103, wherein the innermost volume contains the primary dielectricthermally conductive fluid 106, 108 that either completely or partiallyfills the interior of the sealed enclosure as shown.

Pressure equalization of the innermost volume 150 of the sealedenclosure as well as optional fluid management is provided by a) one ormore first mechanisms disclosed as an internal pressure balancingmechanism and comprised of gaseous fluid compressor 602, pressurizedgaseous fluid storage 604, gaseous fluid entrance assembly 606, gaseousand condensed fluid exhaust assembly 608, and associated connectinglines, valves, sensors, controls, wiring, power, enclosures, andregulators, and b) an optional second mechanism comprised of fluidexchange sealed entrance assembly 408, fluid exchange sealed exhaustassembly 406, pressure balancing system 304, and associated connectinglines, valves, sensors, controls, wiring, power, enclosures, andregulators such that if said first mechanisms and said second mechanismare present in an embodiment, one of the said mechanisms may bedesignated as the primary functional mechanism while the remaining saidmechanisms are designated as secondary functional mechanisms, or all ofthe said mechanisms may be designated as the primary functionalmechanisms. The gaseous fluid compressor 602, pressurized gaseous fluidstorage 604, gaseous fluid entrance assembly 606, gaseous and condensedfluid exhaust assembly 608, and/or fluid exchange sealed entranceassembly 408, fluid exchange sealed exhaust assembly 406, and pressurebalancing system 304 may be configured to function with any primarydielectric thermally conductive fluid, but is used advantageously in theembodiments that contain a) single phase primary dielectric thermallyconductive fluid 106 in the liquid phase, said fluid filling less thanthe entirety of innermost volume 150 with the remaining volume filled byat least one separate and distinct fluid in the gaseous phase 108, b)single phase thermally conductive fluid 106 in the gaseous phase, saidfluid filling the entirety of innermost volume 150, or c) multi-phaseprimary dielectric thermally conductive fluid 106, said fluid at leastpartially filling the innermost volume 150 with portions of said fluidexisting in the liquid phase 106 and portions of said fluid existing inthe gaseous phase 108 in varying proportions relative to thetemperature, pressure, and composition of said multi-phase primarydielectric thermally conductive fluid 106 and if said multi-phaseprimary dielectric thermally conductive fluid 106, 108 fills less thanthe entirety of innermost volume 150, the remaining volume may be filledby at least one separate and distinct fluid in the gaseous phase 108.

The gaseous fluid compressor 602, pressurized gaseous fluid storage 604,gaseous fluid entrance assembly 606, and gaseous and condensed fluidexhaust assembly 608 work in concert to allow gaseous fluid that ispresent in the innermost volume 150 of the sealed enclosure to becompressed and stored for release back into the innermost volume 150 ofthe sealed enclosure as necessary to maintain a specified range of fluidpressure within the innermost volume 150 of the sealed enclosure. Thegaseous fluid entrance assembly 606 may comprise a a) check valve thatallows only fluid in the gaseous phase to flow into the intake of thegaseous fluid compressor 602, or b) a pressure relief valve that allowspressure to be a specified amount greater in innermost volume 150 thanthe pressure in the intake of the gaseous fluid compressor 602. When thefluid pressure in the innermost volume 150 of the sealed enclosure risesabove a specified value, the gaseous fluid compressor 602 is activatedand gaseous fluid 108 flows through the gaseous fluid entrance assembly606 into the intake of the gaseous fluid compressor 602 where suchgaseous fluid is compressed by the gaseous fluid compressor 602 andstored in pressurized gaseous fluid storage 604 thereby lowering thefluid pressure in the innermost volume 150 of the sealed enclosure.

The pressurized gaseous fluid storage 604 may be comprised of thermallyconductive materials configured to effect supplemental heat removal fromthe compressed gaseous fluid 108 by configurations comprisingconstruction methodology or optional heat exchanger 610. In embodimentswith multi-phase thermally conductive fluid, as heat is removed from themulti-phase thermally conductive fluid 108 disposed inside thepressurized gaseous fluid storage 604, at least a portion of themulti-phase thermally conductive fluid 108 in the gaseous phasecondenses to liquid phase 106 and flows as a liquid to the lower part ofpressurized gaseous fluid storage 604 thereby reducing the pressureinside the pressurized gaseous fluid storage 604 as an effect of saidphase change of the multi-phase thermally conductive fluid from thegaseous phase 108 to the liquid phase 106.

The gaseous and condensed fluid exhaust assembly 608 is comprised of apressure regulator and a controllable pressure relief valve as to allowfluid 106, 108 in gaseous and/or liquid phase that is disposed in thepressurized gaseous fluid storage 604 to be discharged into theinnermost volume 150 when conditions exist such as a) a specific commandto act is issued by control systems, b) pressure in innermost volume 150falls below a specified value, c) a sensor internal to the pressurizedgaseous fluid storage 604 detects a liquid condensation level abovespecified value, d) a required operation prior to the operation of thegaseous fluid compressor 602, e) after powering up or before poweringdown the system of electronic devices 104, or f) other conditions asrequired by safety or operational status with said discharge actioncontinuing until such time as a) a sensor internal to the pressurizedgaseous fluid storage 604 detects a liquid condensation level belowspecified value, b) pressure in the innermost volume 150 rise above aspecified value, or c) other conditions as required by safety oroperational status.

An optional heat exchanger 610 comprising a concentric tube, shell andtube, plate, fin, plate-fin, or tube-fin heat exchanger removes heatfrom pressurized gaseous fluid storage 604. The pressurized gaseousfluid storage 604 may be comprised of thermally conductive materialsconfigured to effect supplemental heat removal from the fluid 108 thatis disposed internally to the pressurized gaseous fluid storage 604. Theheat exchanger 610 may be positioned partially or completely inside oroutside of the sealed enclosure. The pressurized gaseous fluid storage604 is cooled by the secondary thermally conductive fluid 120 that isreturned from the secondary fluid heat exchanger 130 via connecting line134 and flows through the heat exchanger 610. In embodiments withmulti-phase thermally conductive fluid, the cooled pressurized gaseousfluid storage 604 serves to remove heat from the multi-phase thermallyconductive fluid 108 that is confined in the pressurized gaseous fluidstorage 604 which may further serve to condense multi-phase thermallyconductive fluid from the gaseous phase 108 into the liquid phase 106 ofsaid fluid, thereby reducing the pressure inside the pressurized gaseousfluid storage 604 as an effect of said phase change of the multi-phasethermally conductive fluid from the gaseous phase 108 to the liquidphase 106.

The fluid exchange sealed entrance assembly 408 and the fluid exchangesealed exhaust assembly 406 work in concert to allow primary dielectricthermally conductive fluid 106, 108 fluid to be exchanged between thesealed enclosure and a pressure balancing system 304, maintaining asealed enclosure environment. The pressure balancing system 304 isclosed loop system that is an adjacently located or remote system thatfunctions to maintain an appropriate fluid presence and pressure at thefluid exchange sealed entrance assembly 408 and the fluid exchangesealed exhaust assembly 406 for one or more sealed enclosures viaconnecting lines. The pressure balancing system 304 is capable ofsupplying fluid pressure to the innermost volume 150 of the sealedenclosure using the fluid exchange sealed entrance assembly 408 viaconnecting lines. The fluid exchange sealed entrance assembly 408 may beconfigured with a pressure relief valve assembly that allows fluidpressure to be released from the pressure balancing system 304 into theinnermost volume 150 of the sealed enclosure when the fluid pressure inthe innermost volume 150 of the sealed enclosure falls below a specifiedvalue thereby raising the fluid pressure in the innermost volume 150 ofthe sealed enclosure. The fluid exchange sealed entrance assembly 408may be optionally configured with a pressure regulator allowing thepressure balancing system 304 to distribute a high fluid pressure tosaid pressure regulator which reduces the fluid pressure to appropriatefluid pressure level for proper pressure relief valve operation. Thefluid exchange sealed entrance assembly 408 may be located either insideor outside the sealed enclosure. The pressure balancing system 304 iscapable of removing fluid pressure from the innermost volume 150 of thesealed enclosure using the fluid exchange sealed exhaust assembly 406via connecting lines. The fluid exchange sealed exhaust assembly 406 maybe configured with a pressure relief valve assembly that allows fluidpressure to be released from innermost volume 150 of the sealedenclosure into the fluid pressure collection functionality of thepressure balancing system 304 when the fluid pressure in the innermostvolume 150 of the sealed enclosure rises above a specified value therebylowering the fluid pressure in the innermost volume 150 of the sealedenclosure. The fluid exchange sealed exhaust assembly 406 may be locatedeither inside or outside the sealed enclosure.

An extended surface configuration of the fluid exchange sealed exhaustassembly 406 may be positioned either inside or outside of the sealedenclosure and is comprised of thermally conductive materials configuredan extended surface area to effect supplement heat removal from theprimary dielectric thermally conductive fluid 106, 108 that istransported through the fluid exchange sealed exhaust assembly 406. Suchextended surface configuration of the fluid exchange sealed exhaustassembly 406 is cooled by the secondary thermally conductive fluid 120that is returned from the secondary fluid heat exchanger 130 viaconnecting line 134 and flows over the extended surface configuration ofthe fluid exchange sealed exhaust assembly 406. The flow of cooledsecondary thermally conductive fluid 120 over the extended surfaceconfiguration of the fluid exchange sealed exhaust assembly 406 servesto remove heat from the primary dielectric thermally conductive fluid106, 108 that is transported through the fluid exchange sealed exhaustassembly 406. This extended surface configuration of the fluid exchangesealed exhaust assembly 406 may be utilized to condense multi-phaseprimary dielectric thermally conductive fluid from the gaseous phase 108back into the liquid phase 106, with the result of returning suchmulti-phase primary dielectric thermally conductive fluid 106 in theliquid phase back into the sealed enclosure by gravity flow or othermechanical means in order to maintain a proper amount of primarydielectric thermally conductive fluid 106 within the sealed enclosure.

One or more optional heat exchange mechanisms 320 may be disposed withinthe innermost volume 150 such that a secondary single phase ormulti-phase thermally conductive fluid 120 is segregated from theprimary dielectric thermally conductive fluid 106, 108 and may becirculated through heat exchange mechanism 320 to an external local orremote heat exchanger assembly 130 via connecting lines 132, 134. Heatexchange mechanisms 320 are disposed within the primary dielectricthermally conductive fluid liquid phase 106 and/or the gaseous phase 108as heat exchange mechanisms comprising concentric tube, shell and tube,plate, fin, plate-fin, tube-fin, condenser tubing, loops, and split-flowloops. Heat exchange mechanisms 320 may be thermally and/or mechanicallyattached or isolated from the innermost enclosure wall 101. Heatexchange mechanisms 320 may be thermally and/or mechanically connectedto portions of the enclosed electronic devices 104.

An optional mechanism may be additionally configured in the innermostvolume 150 of the sealed enclosure in order to effect the circulation ofthe primary dielectric thermally conductive fluid 106 by using fluidpressure to supply the motive force for optional kinetic processes thatcomprise a) fluid circulation by means of a fluid pressure driven pump502, b) fluid circulation by means of a bubbler 506, c) fluidcirculation by means of both a fluid pressure driven pump 502 and abubbler 506, or d) other fluid circulation mechanisms. These optionalmotive force mechanisms are driven by pressured fluid supplied by a)pressurized gaseous fluid storage 604, and/or b) the pressure balancingsystem 304 to the motive force sealed entrance assembly 504 viaconnecting lines. The motive force sealed entrance assembly 504 may beoptionally configured with a pressure regulator allowing the motiveforce fluid pressure source to supply a high pressure fluid to saidpressure regulator which reduces the fluid pressure to appropriate fluidpressure level for the proper operation of the fluid pressure drivenkinetic processes. The motive force sealed entrance assembly 504 may beconfigured with a pressure control valve assembly that allows fluidpressure from the motive force fluid pressure source to be turned on oroff, thereby supplying fluid pressure from the motive force fluidpressure source to kinetic processes such as the fluid pressure drivenpump 502 and/or the bubbler 506 for the purpose of a) circulating theprimary dielectric thermally conductive fluid 106 in order to moreeffectively transfer thermal energy from the enclosed electronic devices104 to the primary dielectric thermally conductive fluid 106 and theinnermost enclosure wall 101, and b) to circulate the primary dielectricthermally conductive fluid 106 through at least one filter to trapimpurities and particulates. Fluid pressure supplied by the motive forcefluid pressure source into the innermost volume 150 of the sealedenclosure via the exhaust of the fluid pressure driven pump 502 and/orthe bubbler 506 is managed by the designated pressure balancing system.Embodiments that circulate the primary dielectric thermally conductivefluid 106 via a pumping action are comprised of a fluid pressure drivenpump 502 connected to the motive force sealed entrance assembly 504, apump intake 312, and a pump discharge 314. Embodiments that circulatethe primary dielectric thermally conductive fluid 106 via a bubblingaction are comprised of a bubbler 506 connected to the motive forcesealed entrance assembly 504, and a bubbler connecting line 508, saidbubbler 506 located in the lower part of the innermost volume 150 of thesealed enclosure and comprising a mechanical means of releasing apressured fluid in a predominately gaseous phase via a number of bubblerpores of various sizes. If the bubbler 506 and the fluid pressure drivenpump 502 are both configured in an embodiment, the fluid pressureutilized to drive the bubbler 506 is supplied by the discharge fluidpressure of the fluid pressure driven pump 502 via connection lines 508.The motive force sealed entrance assembly 504 may be located eitherinside or outside the sealed enclosure.

FIG. 8 shows a conceptual view of a dual port pressure balancingmechanism and/or an internal pressure balancing mechanism used torelieve positive and negative pressures in the intermediate wall of asealed enclosure, optional heat exchange mechanisms, and optionalprimary dielectric thermally conductive fluid pump circulationmechanisms. The sealed enclosure shown in the figure is typical of thedisclosure described in FIG. 2 and is illustrated by showing only aportion of such sealed enclosure as a figure with an innermost enclosurewall 101, intermediate enclosure wall 202, and an outermost enclosurewall 103, wherein the innermost volume 150 contains the primarydielectric thermally conductive fluid 106, 108 that either completely orpartially fills the innermost volume 150 of the sealed enclosure andwherein the intermediate volume 251 contains the secondary intermediatethermally conductive fluid 222, 224 that either completely or partiallyfills the intermediate volume 251 of the sealed enclosure. Thisembodiment is illustrated to disclosure various aspects of embodimentsof pressure balancing, fluid management, and fluid circulationmechanisms configured for multiple wall sealed enclosures as shown inFIG. 2. One skilled in the art, using this disclosure, could developadditional embodiments applying the disclosures in FIGS. 3, 4, 5, 6, 7to sealed enclosures as described in FIG. 2.

Pressure equalization of the intermediate volume 251 of the sealedenclosure as well as optional fluid management is provided by a) anoptional one or more first mechanisms disclosed as an internal pressurebalancing mechanism and comprised of gaseous fluid compressor 602,pressurized gaseous fluid storage 604, gaseous fluid entrance assembly606, gaseous and condensed fluid exhaust assembly 608, and associatedconnecting lines, valves, sensors, controls, wiring, power, enclosures,and regulators, or b) an optional second mechanism comprised of fluidexchange sealed entrance assembly 408, fluid exchange sealed exhaustassembly 406, a pressure balancing system 304, and associated connectinglines, valves, sensors, controls, wiring, power, enclosures, andregulators such that if said first mechanisms and said second mechanismare present in an embodiment, one of the said mechanisms may bedesignated as the primary functional mechanism while the remaining saidmechanisms are designated as secondary functional mechanisms, or all ofthe said mechanisms may be designated as the primary functionalmechanisms. The gaseous fluid compressor 602, pressurized gaseous fluidstorage 604, gaseous fluid entrance assembly 606, gaseous and condensedfluid exhaust assembly 608, and/or fluid exchange sealed entranceassembly 408, fluid exchange sealed exhaust assembly 406, and pressurebalancing system 304 may be configured to function with any secondarythermally conductive fluid, but is used advantageously in theembodiments that contain a) secondary intermediate single phasethermally conductive fluid 222 in the liquid phase, said fluid fillingless than the entirety of intermediate volume 251 with the remainingvolume filled by at least one separate and distinct fluid in the gaseousphase 224, b) secondary intermediate single phase thermally conductivefluid 222 in the gaseous phase, said fluid filling the entirety ofintermediate volume 251, or c) secondary intermediate multi-phase phasethermally conductive fluid 222, said fluid at least partially fillingthe entirety of intermediate volume 251 with portions of said fluidexisting in the liquid phase 222 and portions of said fluid existing inthe gaseous phase 224 in varying proportions relative to thetemperature, pressure, and composition of said secondary intermediatemulti-phase phase thermally conductive fluid 222 and if said secondaryintermediate multi-phase phase thermally conductive fluid 222 fills lessthan the entirety of intermediate volume 251, the remaining volume maybe filled by at least one separate and distinct fluid in the gaseousphase 224.

The gaseous fluid compressor 602, pressurized gaseous fluid storage 604,gaseous fluid entrance assembly 606, and gaseous and condensed fluidexhaust assembly 608 work in concert to allow gaseous fluid that ispresent in the intermediate volume 251 of the sealed enclosure to becompressed and stored for release back into the intermediate volume 251of the sealed enclosure as necessary to maintain a specified range offluid pressure within the intermediate volume 251 of the sealedenclosure. The gaseous fluid entrance assembly 606 may comprise a a)check valve that allows only fluid in the gaseous phase to flow into theintake of the gaseous fluid compressor 602, or b) a pressure reliefvalve that allows pressure to be a specified amount greater inintermediate volume 251 than the pressure in the intake of the gaseousfluid compressor 602. When the fluid pressure in the intermediate volume251 of the sealed enclosure rises above a specified value, the gaseousfluid compressor 602 is activated and gaseous fluid 224 flows throughthe gaseous fluid entrance assembly 606 into the intake of the gaseousfluid compressor 602 where such gaseous fluid is compressed by thegaseous fluid compressor 602 and stored in pressurized gaseous fluidstorage 604 thereby lowering the fluid pressure in the intermediatevolume 251 of the sealed enclosure.

The pressurized gaseous fluid storage 604 may be comprised of thermallyconductive materials configured to effect supplemental heat removal fromthe compressed gaseous fluid 108 by configurations comprisingconstruction methodology or optional heat exchanger 610. In embodimentswith multi-phase thermally conductive fluid, as heat is removed from themulti-phase thermally conductive fluid 224 disposed inside thepressurized gaseous fluid storage 604, at least a portion of themulti-phase thermally conductive fluid 224 in the gaseous phasecondenses to liquid phase 222 and flows as a liquid to the lower part ofpressurized gaseous fluid storage 604 thereby reducing the pressureinside the pressurized gaseous fluid storage 604 as an effect of saidphase change of the multi-phase thermally conductive fluid from thegaseous phase 224 to the liquid phase 222.

The gaseous and condensed fluid exhaust assembly 608 is comprised of apressure regulator and a controllable pressure relief valve as to allowfluid 222, 224 in gaseous and/or liquid phase that is disposed in thepressurized gaseous fluid storage 604 to be discharged into theintermediate volume 251 when conditions exist such as a) a specificcommand to act is issued by control systems, b) pressure in intermediatevolume 251 falls below a specified value, c) a sensor internal to thepressurized gaseous fluid storage 604 detects a liquid condensationlevel above specified value, d) a required operation prior to theoperation of the gaseous fluid compressor 602, e) after powering up orbefore powering down the system of electronic devices 104, or f) otherconditions as required by safety or operational status with saiddischarge action continuing until such time as a) a sensor internal tothe pressurized gaseous fluid storage 604 detects a liquid condensationlevel below specified value, b) pressure in the intermediate volume 251rise above a specified value, or c) other conditions as required bysafety or operational status.

An optional heat exchanger 610 comprising a concentric tube, shell andtube, plate, fin, plate-fin, or tube-fin heat exchanger removes heatfrom pressurized gaseous fluid storage 604. The pressurized gaseousfluid storage 604 may be comprised of thermally conductive materialsconfigured to effect supplemental heat removal from the fluid 108 thatis disposed internally to the pressurized gaseous fluid storage 604. Theheat exchanger 610 may be positioned partially or completely inside oroutside of the sealed enclosure. The pressurized gaseous fluid storage604 is cooled by the secondary thermally conductive fluid 120 that isreturned from the secondary fluid heat exchanger 130 via connecting line134 and flows through the heat exchanger 610. In embodiments withmulti-phase thermally conductive fluid, the cooled pressurized gaseousfluid storage 604 serves to remove heat from the multi-phase thermallyconductive fluid 224 that is confined in the pressurized gaseous fluidstorage 604 which may further serve to condense multi-phase thermallyconductive fluid from the gaseous phase 224 into the liquid phase 222 ofsaid fluid, thereby reducing the pressure inside the pressurized gaseousfluid storage 604 as an effect of said phase change of the multi-phasethermally conductive fluid from the gaseous phase 224 to the liquidphase 222.

The fluid exchange sealed entrance assembly 408 and the fluid exchangesealed exhaust assembly 406 work in concert to allow secondaryintermediate thermally conductive fluid 222, 224 fluid to be exchangedbetween the sealed enclosure and a pressure balancing system 304,maintaining a sealed enclosure environment. The pressure balancingsystem 304 is closed loop system that is an adjacently located or remotesystem that functions to maintain an appropriate fluid presence andpressure at the fluid exchange sealed entrance assembly 408 and thefluid exchange sealed exhaust assembly 406 for one or more sealedenclosures via connecting lines. The pressure balancing system 304 iscapable of supplying fluid pressure to the intermediate volume 251 ofthe sealed enclosure using the fluid exchange sealed entrance assembly408 via connecting lines. The fluid exchange sealed entrance assembly408 may be configured with a pressure relief valve assembly that allowsfluid pressure to be released from the pressure balancing system 304into the intermediate volume 251 of the sealed enclosure when the fluidpressure in the intermediate volume 251 of the sealed enclosure fallsbelow a specified value thereby raising the fluid pressure in theintermediate volume 251 of the sealed enclosure. The fluid exchangesealed entrance assembly 408 may be optionally configured with apressure regulator allowing the pressure balancing system 304 todistribute a high fluid pressure to said pressure regulator whichreduces the fluid pressure to appropriate fluid pressure level forproper pressure relief valve operation. The fluid exchange sealedentrance assembly 408 may be located either inside or outside the sealedenclosure.

The pressure balancing system 304 is capable of removing fluid pressurefrom the intermediate volume 251 of the sealed enclosure using the fluidexchange sealed exhaust assembly 406 via connecting lines. The fluidexchange sealed exhaust assembly 406 may be configured with a pressurerelief valve assembly that allows fluid pressure to be released fromintermediate volume 251 of the sealed enclosure into the fluid pressurecollection functionality of the pressure balancing system 304 when thefluid pressure in the intermediate volume 251 of the sealed enclosurerises above a specified value thereby lowering the fluid pressure in theintermediate volume 251 of the sealed enclosure. The fluid exchangesealed exhaust assembly 406 may be located either inside or outside thesealed enclosure.

An extended surface configuration of the fluid exchange sealed exhaustassembly 406 may be positioned either inside or outside of the sealedenclosure and is comprised of thermally conductive materials configuredan extended surface area to effect supplement heat removal from thesecondary intermediate thermally conductive fluid 222, 224 that istransported through the fluid exchange sealed exhaust assembly 406. Suchextended surface configuration of the fluid exchange sealed exhaustassembly 406 is cooled by the secondary thermally conductive fluid 120that is returned from the secondary fluid heat exchanger 130 viaconnecting line 134 and flows over the extended surface configuration ofthe fluid exchange sealed exhaust assembly 406. The flow of cooledsecondary thermally conductive fluid 120 over the extended surfaceconfiguration of the fluid exchange sealed exhaust assembly 406 servesto remove heat from the secondary thermally conductive fluid 222, 224that is transported through the fluid exchange sealed exhaust assembly406. This extended surface configuration of the fluid exchange sealedexhaust assembly 406 may be utilized to condense multi-phase primarydielectric thermally conductive fluid from the gaseous phase 224 backinto the liquid phase 222, with the result of returning such secondaryintermediate thermally conductive fluid 222 in the liquid phase backinto the sealed enclosure by gravity flow or other mechanical means inorder to maintain a proper amount of secondary intermediate thermallyconductive fluid 222 within the sealed enclosure.

One or more optional heat exchange mechanisms 320 may be disposed withinthe intermediate volume 251 such that a secondary single phase ormulti-phase thermally conductive fluid 120 is segregated from thesecondary thermally conductive fluid 222, 224 and may be circulatedthrough heat exchange mechanism 320 to an external local or remote heatexchanger assembly 130 via connecting lines 132, 134. Heat exchangemechanisms 320 are disposed within the secondary thermally conductivefluid liquid phase 222 and/or the gaseous phase 224 as heat exchangemechanisms comprising concentric tube, shell and tube, plate, fin,plate-fin, tube-fin, condenser tubing, loops, and split-flow loops. Heatexchange mechanisms 320 may be thermally and/or mechanically attached orisolated from the enclosure wall 101, 202.

Heat exchange, control, pressure balancing, fluid maintenance, and/orfluid circulation functionality of the innermost volume 150 of thesealed enclosure may be provided for by applying any of the disclosuresin FIGS. 3, 4, 5, 6, 7 to innermost volume 150 of the sealed enclosure.Optional mechanisms may be additionally configured in the innermostvolume 150 of the sealed enclosure in order to effect the circulation ofthe primary dielectric thermally conductive fluid 106 for the purpose ofa) circulating the primary dielectric thermally conductive fluid 106 inorder to more effectively transfer thermal energy from the enclosedelectronic devices 104 to the primary dielectric thermally conductivefluid 106 and the innermost enclosure wall 101, and b) to circulate theprimary dielectric thermally conductive fluid 106 through at least onefilter to trap impurities and particulates, embodiments of suchmechanisms comprise a) a mechanism comprised of a fluid pump 310, a pumpintake 312, and a pump discharge 314, or b) a mechanism comprised of animpeller, fan, turbine, or propeller that rotates under motive force.

FIG. 9 shows a conceptual view of a sealed enclosure design comprisingan enclosure wall 901 that enclose electronic devices 104 and a primarydielectric thermally conductive fluid 106, 108 in the innermost volume150 and an optional heat exchange mechanism 920 in the innermost volume150 that contains a secondary thermally conductive fluid 120. Theinnermost volume 150 contains a single phase or multi-phase primarydielectric thermally conductive fluid 106, 108 in which electronicdevices 104 to be cooled are immersed or surrounded. The single phase ormulti-phase primary dielectric thermally conductive fluid 106, 108 maybe in a predominately liquid phase, gaseous phase, or in a combinationliquid phase and gaseous phase. In an embodiment that comprises a singlephase primary dielectric thermally conductive fluid 106 in the gaseousphase, said fluid will fill the entirety of innermost volume 150. In anembodiment that comprises a single phase primary dielectric thermallyconductive fluid 106 in the liquid phase, said fluid may fill theentirety of innermost volume 150 or may fill less than the entirety ofinnermost volume 150 with the remaining volume filled by at least oneseparate and distinct fluid in the gaseous phase 108. In an embodimentthat comprises a multi-phase primary dielectric thermally conductivefluid 106, said fluid may fill the entirety of innermost volume 150 withportions of said fluid existing in the liquid phase 106 and portions ofsaid fluid existing in the gaseous phase 108 in varying proportionsrelative to the temperature, pressure, and composition of saidmulti-phase primary dielectric thermally conductive fluid 106 and ifsaid multi-phase primary dielectric thermally conductive fluid 106, 108fills less than the entirety of innermost volume 150, the remainingvolume may be filled by at least one separate and distinct fluid in thegaseous phase 108.

Embodiments of the disclosed sealed enclosure may be configured withsingle phase or multi-phase thermally conductive fluids. A single phasethermally conductive fluid will transfer heat using the principles ofconvection and conduction. A multi-phase thermally conductive fluid willtransfer heat using the principles of convection, conduction, and phasechange. As the multi-phase thermally conductive fluid in the liquidphase absorbs heat, a portion of said fluid is converted to the gaseousphase. Conversely, as the multi-phase thermally conductive fluid in thegaseous phase gives up heat by various heat exchange processes, aportion of said multi-phase thermally conductive fluid in the gaseousphase condenses back into multi-phase thermally conductive fluid in theliquid phase. If the amount of fluid in the gaseous phase 108 exceedsthe volume of space internal to the sealed enclosure that is unoccupiedby the multi-phase thermally conductive fluid in the liquid phase 106,said fluid in the gaseous phase 108 will exert a positive pressureinside the innermost volume 150 of the sealed enclosure. Conversely, ifthe amount of fluid in the gaseous phase 108 is less than the volume ofspace internal to the sealed enclosure that is unoccupied by themulti-phase thermally conductive fluid in the liquid phase 106, saidfluid in the gaseous phase 108 will exert a negative pressure inside theinnermost volume 150 of the sealed enclosure. In addition, some amountof multi-phase thermally conductive fluid in the gaseous phase 108 andoptional other distinct and suitable compressible gaseous fluid mayexist in a space of the sealed enclosure for various purposes comprisingcushioning positive and negative pressures in the sealed enclosure,maintaining a headspace in a specified range of pressure as temperaturevaries, displacing thermally conductive fluid to allow weightadjustments to the overall sealed enclosure, and/or allowingaccumulation of gaseous fluid used to drive internal kinetic processesor gaseous based mixing functionality. A single phase thermallyconductive fluid may either completely or partially fill a space of thesealed enclosure and any space in the sealed enclosure that is notfilled by said single phase thermally conductive fluid may be filledwith a distinct and suitable compressible gaseous fluid for variouspurposes comprising cushioning positive and negative pressures in thesealed enclosure, maintaining a headspace in a specified range ofpressure as temperature varies, displacing thermally conductive fluid toallow weight adjustments to the overall sealed enclosure, and/orallowing accumulation of gaseous fluid used to drive internal kineticprocesses or gaseous based mixing functionality.

Electronic devices 104 may be disposed within the innermost volume 150of the sealed enclosure in a variety of configurations to facilitatethermal transfer and best practice process efficiency. The enclosedelectronic devices 104 dissipate internally generated heat into theinnermost volume 150, the primary dielectric thermally conductive fluid106, and the enclosure walls 901 of the sealed enclosure. One or moreoptional heat exchange mechanisms 920 may be disposed within theinnermost volume 150 such that a secondary single phase or multi-phasethermally conductive fluid 120 is segregated from the primary dielectricthermally conductive fluid 106, 108 and may be circulated through heatexchange mechanism 920 to an external local or remote heat exchangerassembly 130 via connecting lines 132, 134.

Heat exchange mechanisms 920 may be disposed within the primarydielectric thermally conductive fluid liquid phase 106 and/or thegaseous phase 108 as heat exchange mechanisms comprising concentrictube, shell and tube, plate, fin, plate-fin, tube-fin, condenser tubing,loops, and split-flow loops. Heat exchange mechanisms 920 may bethermally and/or mechanically attached or isolated from enclosure walls901. Heat exchange mechanisms 920 may be thermally and/or mechanicallyconnected to portions of the enclosed electronic devices 104.

The secondary single phase or multi-phase thermally conductive fluid 120may be in a predominately liquid phase, gaseous phase, or in acombination liquid phase and gaseous phase. The secondary thermallyconductive fluid 120 is circulated away from the sealed enclosure via afluid-tight piping connection 132, is presented to one or more heatexchanger assemblies 130 for the purpose of removing heat from thefluid, and returned to the sealed enclosure via a fluid-tight pipingconnection 134. The secondary thermally conductive fluid 120: a) iscirculated within a heat exchanger mechanism 920 disposed in innermostvolume 150 where internal heat is absorbed from within innermost volume150; b) is removed from a heat exchange mechanism 920 and circulatedthrough an adjacent heat exchange assembly 130 where a portion of theheat is removed from the thermally conductive fluid 120; and c) isreturned to a heat exchange mechanism 920. The secondary thermallyconductive fluid 120 is circulated in such a fashion as to provideappropriate heat removal from the sealed enclosure. Heat exchange may beaccomplished by a variety of means to one or more external heat sinksystems 130 that may be of various types including ventilation,compression, evaporation, and geothermal systems. The heat exchangesystem 130 may reject heat directly into the immediate environment viapassive or forced circulation, or the fluid may be circulated away fromthe sealed enclosure, cooled in a remote location, and thenre-circulated back to the sealed enclosure at a lower temperature. Theenclosure wall 901 may thermally conductive to function as a heatexchanger or thermally insulating.

The enclosure walls 901 may be thermally connected by mechanicalconnection or other means. Portions of the enclosure walls 901 may beoptionally bonded to additional materials that facilitate enhancedthermal conduction or thermal insulation of the enclosure walls 901. Theoutermost surface of enclosure walls 901 may reject heat into objectsand the environment that surround the sealed enclosure. Cooling fins maybe affixed to the wall surfaces 901 to aid in heat transport anddissipation. Wall surfaces 901 may have surface features of variousdimensionality to aid in heat transport and dissipation. The sealedenclosure has fluid-tight entrances 110 from the outermost surface tothe innermost volume 150 for power, networking, and other control andmonitoring signals and functions which are appropriately connected toone or more electronic or other functional devices disposed in theinnermost volume 150 of the sealed enclosure.

The sealed enclosure may optionally comprise heat exchange, control,pressure balancing, fluid maintenance, and/or fluid circulationfunctionality as described in FIGS. 10, 11, 12, 13, 14. Embodimentvariations and details described herein apply equally to sealedenclosures with or without an interior 108 fluid head space. The sealedenclosure may optionally comprise one or more channels disposed in theinnermost volume 150 as described in FIGS. 15, 16. The sealed enclosuremay optionally comprise one or more spacers disposed in the innermostvolume 150 of the sealed enclosure as described in FIG. 17. The sealedenclosure may optionally comprise one or more mechanisms in theinnermost volume 150 to render the electronic devices and any contentstored on those devices to be permanently unusable and unreadable asdescribed in FIG. 18.

The sealed enclosure may be located either adjacent to or remote fromany heat exchange assemblies 130 and/or pressure balancing systems andappropriate fluid transport channels between said locations are selectedbased optimal fluid flow and thermodynamic designs for the selectedfluids. Further, any heat exchange assemblies 130 and/or pressurebalancing systems may perform their indicated functions for one or moresealed enclosures. Sealed enclosures can be installed in anyorientation, placed as standalone units or stacked or grouped togetherto form a single structural unit of any dimensionality in a high-densityconfiguration.

FIG. 10 shows a conceptual view of a single port pressure balancingmechanism used to relieve positive and negative pressures in a sealedenclosure and optional primary dielectric thermally conductive fluidpump circulation mechanisms. The sealed enclosure shown in the figure istypical of the disclosures described in FIG. 9 and is illustrated byshowing only a portion of such sealed enclosure as a figure with anenclosure wall 901, wherein the innermost volume 150 contains a primarydielectric thermally conductive fluid 106, 108 that either completely orpartially fills the interior of the sealed enclosure as shown.

The fluid exchange sealed entrance assembly 302 allows primarydielectric thermally conductive fluid 106, 108 fluid to be exchangedbetween the sealed enclosure and a pressure balancing system 304,maintaining a sealed enclosure environment and functioning for thepurpose of pressure equalization of the innermost volume 150 of thesealed enclosure and providing optional fluid management. The fluidexchange sealed entrance assembly 302 and pressure balancing system 304may be configured to function with any primary dielectric thermallyconductive fluid, but is used advantageously in embodiments that containa) a single phase primary dielectric thermally conductive fluid 106 inthe liquid phase, said fluid filling less than the entirety of innermostvolume 150 with the remaining volume filled by at least one separate anddistinct fluid in the gaseous phase 108, b) a single phase thermallyconductive fluid 106 in the gaseous phase, said fluid filling theentirety of innermost volume 150, or c) a multi-phase primary dielectricthermally conductive fluid 106, said fluid at least partially fillingthe innermost volume 150 with portions of said fluid existing in theliquid phase 106 and portions of said fluid existing in the gaseousphase 108 in varying proportions relative to the temperature, pressure,and composition of said multi-phase primary dielectric thermallyconductive fluid 106 and if said multi-phase primary dielectricthermally conductive fluid 106, 108 fills less than the entirety ofinnermost volume 150, the remaining volume may be filled by at least oneseparate and distinct fluid in the gaseous phase 108.

The pressure balancing system 304 is an adjacently located or remotesystem that functions to maintain a suitably constant fluid presence andpressure to the fluid exchange sealed entrance assembly 302 for one ormore sealed enclosures. The pressure balancing system 304 is capable ofsupplying pressure to or removing pressure from the sealed enclosureusing a single fluid exchange sealed entrance assembly 302 viaconnecting lines.

An optional heat exchanger 1001 may wrap around the fluid exchangesealed entrance assembly 302 positioned either inside or outside of thesealed enclosure in which the fluid exchange sealed entrance assembly302 includes a heat exchanger comprising a concentric tube, shell andtube, plate, fin, plate-fin, or tube-fin heat exchanger and isconfigured to effect supplemental heat removal from the primarydielectric thermally conductive fluid 106, 108 that is transportedthrough the fluid exchange sealed entrance assembly 302. Suchconfiguration of the fluid exchange sealed entrance assembly 302 iscooled by the secondary thermally conductive fluid 120 that is returnedfrom the secondary fluid heat exchanger 130 via connecting line 134 andflows through the heat exchanger 1001 and around a portion of the fluidexchange sealed entrance assembly 302. The cooled fluid exchange sealedentrance assembly 302 serves to remove heat from the primary dielectricthermally conductive fluid 106, 108 that is transported through thefluid exchange sealed entrance assembly 302 which may further serve tocondense multi-phase primary dielectric thermally conductive fluid fromthe gaseous phase 108 into the liquid phase 106 of said fluid, with theresult of returning the multi-phase primary dielectric thermallyconductive fluid 106 in the liquid phase back into the sealed enclosureby gravity flow or other mechanical means in order to maintain a properamount of primary dielectric thermally conductive fluid 106 within thesealed enclosure.

Optional mechanisms may be additionally configured in the innermostvolume 150 of the sealed enclosure in order to effect the circulation ofthe primary dielectric thermally conductive fluid 106 for the purpose ofa) circulating the primary dielectric thermally conductive fluid 106 inorder to more effectively transfer thermal energy from the enclosedelectronic devices 104 to the primary dielectric thermally conductivefluid 106 and the enclosure wall 901, and b) to circulate the primarydielectric thermally conductive fluid 106 through at least one filter totrap impurities and particulates, embodiments of such mechanismscomprise a) a mechanism comprised of a fluid pump 310, a pump intake312, and a pump discharge 314, or b) a mechanism comprised of animpeller, fan, turbine, or propeller that rotates under motive force.

FIG. 11 shows a conceptual view of a dual port pressure balancingmechanism used to relieve positive and negative pressures in a sealedenclosure and optional primary dielectric thermally conductive fluidpump circulation mechanisms. The sealed enclosure shown in the figure istypical of the disclosures described in FIG. 9 and is illustrated byshowing only a portion of such sealed enclosure as a figure with anenclosure wall 901, wherein the innermost volume 150 contains a primarydielectric thermally conductive fluid 106, 108 that either completely orpartially fills the interior of the sealed enclosure as shown.

The fluid exchange sealed entrance assembly 408 and the fluid exchangesealed exhaust assembly 406 work in concert to allow primary dielectricthermally conductive fluid 106, 108 fluid to be exchanged between thesealed enclosure and a pressure balancing system 304, maintaining asealed enclosure environment and functioning for the purpose of pressureequalization of the innermost volume 150 of the sealed enclosure andproviding optional fluid management. The fluid exchange sealed entranceassembly 408, the fluid exchange sealed exhaust assembly 406, and thepressure balancing system 304 may be configured to function with anyprimary dielectric thermally conductive fluid, but is usedadvantageously in the embodiments that contain a) a single phase primarydielectric thermally conductive fluid 106 in the liquid phase, saidfluid filling less than the entirety of innermost volume 150 with theremaining volume filled by at least one separate and distinct fluid inthe gaseous phase 108, b) a single phase thermally conductive fluid 106in the gaseous phase, said fluid filling the entirety of innermostvolume 150, or c) a multi-phase primary dielectric thermally conductivefluid 106, said fluid at least partially filling the innermost volume150 with portions of said fluid existing in the liquid phase 106 andportions of said fluid existing in the gaseous phase 108 in varyingproportions relative to the temperature, pressure, and composition ofsaid multi-phase primary dielectric thermally conductive fluid 106 andif said multi-phase primary dielectric thermally conductive fluid 106,108 fills less than the entirety of innermost volume 150, the remainingvolume may be filled by at least one separate and distinct fluid in thegaseous phase 108.

The pressure balancing system 304 is closed loop system that is anadjacently located or remote system that functions to maintain anappropriate fluid presence and pressure at the fluid exchange sealedentrance assembly 408 and the fluid exchange sealed exhaust assembly 406for one or more sealed enclosures via connecting lines. The pressurebalancing system 304 is capable of supplying fluid pressure to theinnermost volume 150 of the sealed enclosure using the fluid exchangesealed entrance assembly 408 via connecting lines. The fluid exchangesealed entrance assembly 408 may be configured with a pressure reliefvalve assembly that allows fluid pressure to be released from thepressure balancing system 304 into the innermost volume 150 of thesealed enclosure when the fluid pressure in the innermost volume 150 ofthe sealed enclosure falls below a specified value thereby raising thefluid pressure in the innermost volume 150 of the sealed enclosure. Thefluid exchange sealed entrance assembly 408 may be optionally configuredwith a pressure regulator allowing the pressure balancing system 304 todistribute a high fluid pressure to said pressure regulator whichreduces the fluid pressure to appropriate fluid pressure level forproper pressure relief valve operation. The fluid exchange sealedentrance assembly 408 may be located either inside or outside the sealedenclosure.

The pressure balancing system 304 is capable of removing fluid pressurefrom the innermost volume 150 of the sealed enclosure using the fluidexchange sealed exhaust assembly 406 via connecting lines. The fluidexchange sealed exhaust assembly 406 may be configured with a pressurerelief valve assembly that allows fluid pressure to be released frominnermost volume 150 of the sealed enclosure into the fluid pressurecollection functionality of the pressure balancing system 304 when thefluid pressure in the innermost volume 150 of the sealed enclosure risesabove a specified value thereby lowering the fluid pressure in theinnermost volume 150 of the sealed enclosure. The fluid exchange sealedexhaust assembly 406 may be located either inside or outside the sealedenclosure.

An optional heat exchanger 1101 may wrap around the fluid exchangesealed exhaust assembly 406 positioned either inside or outside of thesealed enclosure in which the fluid exchange sealed exhaust assembly 406includes a heat exchanger comprising a concentric tube, shell and tube,plate, fin, plate-fin, or tube-fin heat exchanger and is configured toeffect supplemental heat removal from the primary dielectric thermallyconductive fluid 106, 108 that is transported through the fluid exchangesealed exhaust assembly 406. Such configuration of the fluid exchangesealed exhaust assembly 406 is cooled by the secondary thermallyconductive fluid 120 that is returned from the secondary fluid heatexchanger 130 via connecting line 134 and flows through the heatexchanger 1101 and around a portion of the fluid exchange sealed exhaustassembly 406. The cooled fluid exchange sealed exhaust assembly 406serves to remove heat from the primary dielectric thermally conductivefluid 106, 108 that is transported through the fluid exchange sealedexhaust assembly 406 which may further serve to condense multi-phaseprimary dielectric thermally conductive fluid from the gaseous phase 108into the liquid phase 106 of said fluid, with the result of returningthe multi-phase primary dielectric thermally conductive fluid 106 in theliquid phase back into the sealed enclosure by gravity flow or othermechanical means in order to maintain a proper amount of primarydielectric thermally conductive fluid 106 within the sealed enclosure.

Optional mechanisms may be additionally configured in the innermostvolume 150 of the sealed enclosure in order to effect the circulation ofthe primary dielectric thermally conductive fluid 106 for the purpose ofa) circulating the primary dielectric thermally conductive fluid 106 inorder to more effectively transfer thermal energy from the enclosedelectronic devices 104 to the primary dielectric thermally conductivefluid 106 and the enclosure wall 901, and b) to circulate the primarydielectric thermally conductive fluid 106 through at least one filter totrap impurities and particulates, embodiments of such mechanismscomprise a) a mechanism comprised of a fluid pump 310, a pump intake312, and a pump discharge 314, or b) a mechanism comprised of animpeller, fan, turbine, or propeller that rotates under motive force.

FIG. 12 shows a conceptual view of a dual port pressure balancingmechanism used to relieve positive and negative pressures in a sealedenclosure and optional pressurized gaseous fluid driven primarydielectric thermally conductive fluid pump and bubbler circulationmechanisms. The sealed enclosure shown in the figure is typical of thedisclosures described in FIG. 9 and is illustrated by showing only aportion of such sealed enclosure as a figure with an enclosure wall 901,wherein the innermost volume 150 contains a primary dielectric thermallyconductive fluid 106, 108 that either completely or partially fills theinterior of the sealed enclosure as shown.

The fluid exchange sealed entrance assembly 408 and the fluid exchangesealed exhaust assembly 406 work in concert to allow primary dielectricthermally conductive fluid 106, 108 fluid to be exchanged between thesealed enclosure and a pressure balancing system 304, maintaining asealed enclosure environment and functioning for the purpose of pressureequalization of the innermost volume 150 of the sealed enclosure,providing optional fluid management, and providing optional motive forceto kinetic processes located in the innermost volume 150 of the sealedenclosure. The fluid exchange sealed entrance assembly 408, the fluidexchange sealed exhaust assembly 406, and the pressure balancing system304 may be configured to function with any primary dielectric thermallyconductive fluid, but is used advantageously in the embodiments thatcontain a) a single phase primary dielectric thermally conductive fluid106 in the liquid phase, said fluid filling less than the entirety ofinnermost volume 150 with the remaining volume filled by at least oneseparate and distinct fluid in the gaseous phase 108, b) a single phasethermally conductive fluid 106 in the gaseous phase, said fluid fillingthe entirety of innermost volume 150, or c) a multi-phase primarydielectric thermally conductive fluid 106, said fluid at least partiallyfilling the innermost volume 150 with portions of said fluid existing inthe liquid phase 106 and portions of said fluid existing in the gaseousphase 108 in varying proportions relative to the temperature, pressure,and composition of said multi-phase primary dielectric thermallyconductive fluid 106 and if said multi-phase primary dielectricthermally conductive fluid 106, 108 fills less than the entirety ofinnermost volume 150, the remaining volume may be filled by at least oneseparate and distinct fluid in the gaseous phase 108.

The pressure balancing system 304 is closed loop system that is anadjacently located or remote system that functions to maintain anappropriate fluid presence and pressure at the fluid exchange sealedentrance assembly 408 and the fluid exchange sealed exhaust assembly 406for one or more sealed enclosures via connecting lines. The pressurebalancing system 304 is capable of supplying fluid pressure to theinnermost volume 150 of the sealed enclosure using the fluid exchangesealed entrance assembly 408 via connecting lines. The fluid exchangesealed entrance assembly 408 may be configured with a pressure reliefvalve assembly that allows fluid pressure to be released from thepressure balancing system 304 into the innermost volume 150 of thesealed enclosure when the fluid pressure in the innermost volume 150 ofthe sealed enclosure falls below a specified value thereby raising thefluid pressure in the innermost volume 150 of the sealed enclosure. Thefluid exchange sealed entrance assembly 408 may be optionally configuredwith a pressure regulator allowing the pressure balancing system 304 todistribute a high fluid pressure to said pressure regulator whichreduces the fluid pressure to appropriate fluid pressure level forproper pressure relief valve operation. The fluid exchange sealedentrance assembly 408 may be located either inside or outside the sealedenclosure.

The pressure balancing system 304 is capable of removing fluid pressurefrom the innermost volume 150 of the sealed enclosure using the fluidexchange sealed exhaust assembly 406 via connecting lines. The fluidexchange sealed exhaust assembly 406 may be configured with a pressurerelief valve assembly that allows fluid pressure to be released frominnermost volume 150 of the sealed enclosure into the fluid pressurecollection functionality of the pressure balancing system 304 when thefluid pressure in the innermost volume 150 of the sealed enclosure risesabove a specified value thereby lowering the fluid pressure in theinnermost volume 150 of the sealed enclosure. The fluid exchange sealedexhaust assembly 406 may be located either inside or outside the sealedenclosure.

An optional heat exchanger 1101 may wrap around the fluid exchangesealed exhaust assembly 406 positioned either inside or outside of thesealed enclosure in which the fluid exchange sealed exhaust assembly 406includes a heat exchanger comprising a concentric tube, shell and tube,plate, fin, plate-fin, or tube-fin heat exchanger and is configured toeffect supplemental heat removal from the primary dielectric thermallyconductive fluid 106, 108 that is transported through the fluid exchangesealed exhaust assembly 406. Such configuration of the fluid exchangesealed exhaust assembly 406 is cooled by the secondary thermallyconductive fluid 120 that is returned from the secondary fluid heatexchanger 130 via connecting line 134 and flows through the heatexchanger 1101 and around a portion of the fluid exchange sealed exhaustassembly 406. The cooled fluid exchange sealed exhaust assembly 406serves to remove heat from the primary dielectric thermally conductivefluid 106, 108 that is transported through the fluid exchange sealedexhaust assembly 406 which may further serve to condense multi-phaseprimary dielectric thermally conductive fluid from the gaseous phase 108into the liquid phase 106 of said fluid, with the result of returningthe multi-phase primary dielectric thermally conductive fluid 106 in theliquid phase back into the sealed enclosure by gravity flow or othermechanical means in order to maintain a proper amount of primarydielectric thermally conductive fluid 106 within the sealed enclosure.

An optional mechanism may be additionally configured in the innermostvolume 150 of the sealed enclosure in order to effect the circulation ofthe primary dielectric thermally conductive fluid 106 by using fluidpressure to supply the motive force for optional kinetic processes thatinclude a) fluid circulation by means of a fluid pressure driven pump502, b) fluid circulation by means of a bubbler 506, c) fluidcirculation by means of both a fluid pressure driven pump 502 and abubbler 506, or d) other fluid circulation mechanisms. These optionalmotive force mechanisms are driven by pressured fluid supplied by thepressure balancing system 304 to the motive force sealed entranceassembly 504 via connecting lines. The motive force sealed entranceassembly 504 may be optionally configured with a pressure regulatorallowing the motive force fluid pressure source to supply a highpressure fluid to said pressure regulator which reduces the fluidpressure to appropriate fluid pressure level for the proper operation ofthe fluid pressure driven kinetic processes. The motive force sealedentrance assembly 504 may be configured with a pressure control valveassembly that allows fluid pressure from the pressure balancing system304 to be turned on or off, thereby supplying fluid pressure from thepressure balancing system 304 to kinetic processes such as the fluidpressure driven pump 502 and/or the bubbler 506 for the purpose of a)circulating the primary dielectric thermally conductive fluid 106 inorder to more effectively transfer thermal energy from the enclosedelectronic devices 104 to the primary dielectric thermally conductivefluid 106 and the enclosure wall 901, and b) to circulate the primarydielectric thermally conductive fluid 106 through at least one filter totrap impurities and particulates. Fluid pressure supplied by thepressure balancing system 304 into the innermost volume 150 of thesealed enclosure via the exhaust of the fluid pressure driven pump 502and/or the bubbler 506 is returned to the pressure balancing system 304through the fluid exchange sealed exhaust assembly 406. Embodiments thatcirculate the primary dielectric thermally conductive fluid 106 via apumping action are comprised of a fluid pressure driven pump 502connected to the motive force sealed entrance assembly 504, a pumpintake 312, and a pump discharge 314. Embodiments that circulate theprimary dielectric thermally conductive fluid 106 via a bubbling actionare comprised of a bubbler 506 connected to the motive force sealedentrance assembly 504, and a bubbler connecting line 508, said bubbler506 located in the lower part of the innermost volume 150 of the sealedenclosure and comprising a mechanical means of releasing a pressuredfluid in a predominately gaseous phase via a number of bubbler pores ofvarious sizes. If the bubbler 506 and the fluid pressure driven pump 502are both configured in an embodiment, the fluid pressure utilized todrive the bubbler 506 is supplied by the discharge fluid pressure of thefluid pressure driven pump 502 via connection lines 508. The motiveforce sealed entrance assembly 504 may be located either inside oroutside the sealed enclosure.

FIG. 13 shows a conceptual view of an internal pressure balancingmechanism with optional dual port pressure balancing mechanism used torelieve positive and negative pressures in a sealed enclosure andoptional primary dielectric thermally conductive fluid pump circulationmechanisms. The sealed enclosure shown in the figure is typical of thedisclosures described in FIG. 9 and is illustrated by showing only aportion of such sealed enclosure as a figure with an enclosure wall 901,wherein the innermost volume 150 contains a primary dielectric thermallyconductive fluid 106, 108 that either completely or partially fills theinterior of the sealed enclosure as shown

Pressure equalization of the innermost volume 150 of the sealedenclosure as well as optional fluid management is provided by a) one ormore first mechanisms comprised of gaseous fluid compressor 602,pressurized gaseous fluid storage 604, gaseous fluid entrance assembly606, gaseous and condensed fluid exhaust assembly 608, and associatedconnecting lines, valves, sensors, controls, wiring, power, enclosures,and regulators, and b) an optional second mechanism comprised of a fluidexchange sealed entrance assembly 408, fluid exchange sealed exhaustassembly 406, pressure balancing system 304, and associated connectinglines, valves, sensors, controls, wiring, power, enclosures, andregulators such that if said first mechanisms and said second mechanismare present in an embodiment, one of the said mechanisms may bedesignated as the primary functional mechanism while the remaining saidmechanisms are designated as secondary functional mechanisms, or all ofthe said mechanisms may be designated as the primary functionalmechanisms. The gaseous fluid compressor 602, pressurized gaseous fluidstorage 604, gaseous fluid entrance assembly 606, gaseous and condensedfluid exhaust assembly 608, and/or fluid exchange sealed entranceassembly 408, fluid exchange sealed exhaust assembly 406, and pressurebalancing system 304 may be configured to function with any primarydielectric thermally conductive fluid, but is used advantageously in theembodiments that contain a) single phase primary dielectric thermallyconductive fluid 106 in the liquid phase, said fluid filling less thanthe entirety of innermost volume 150 with the remaining volume filled byat least one separate and distinct fluid in the gaseous phase 108, b)single phase thermally conductive fluid 106 in the gaseous phase, saidfluid filling the entirety of innermost volume 150, or c) multi-phaseprimary dielectric thermally conductive fluid 106, said fluid at leastpartially filling the innermost volume 150 with portions of said fluidexisting in the liquid phase 106 and portions of said fluid existing inthe gaseous phase 108 in varying proportions relative to thetemperature, pressure, and composition of said multi-phase primarydielectric thermally conductive fluid 106 and if said multi-phaseprimary dielectric thermally conductive fluid 106, 108 fills less thanthe entirety of innermost volume 150, the remaining volume may be filledby at least one separate and distinct fluid in the gaseous phase 108.

The gaseous fluid compressor 602, pressurized gaseous fluid storage 604,gaseous fluid entrance assembly 606, and gaseous and condensed fluidexhaust assembly 608 work in concert to allow gaseous fluid that ispresent in the innermost volume 150 of the sealed enclosure to becompressed and stored for release back into the innermost volume 150 ofthe sealed enclosure as necessary to maintain a specified range of fluidpressure within the innermost volume 150 of the sealed enclosure. Thegaseous fluid entrance assembly 606 may comprise a a) check valve thatallows only fluid in the gaseous phase to flow into the intake of thegaseous fluid compressor 602, or b) a pressure relief valve that allowspressure to be a specified amount greater in innermost volume 150 thanthe pressure in the intake of the gaseous fluid compressor 602. When thefluid pressure in the innermost volume 150 of the sealed enclosure risesabove a specified value, the gaseous fluid compressor 602 is activatedand gaseous fluid 108 flows through the gaseous fluid entrance assembly606 into the intake of the gaseous fluid compressor 602 where suchgaseous fluid is compressed by the gaseous fluid compressor 602 andstored in pressurized gaseous fluid storage 604 thereby lowering thefluid pressure in the innermost volume 150 of the sealed enclosure.

The pressurized gaseous fluid storage 604 may be comprised of thermallyconductive materials configured to effect supplemental heat removal fromthe compressed gaseous fluid 108 by configurations comprisingconstruction methodology or optional heat exchanger 1310. In embodimentswith multi-phase thermally conductive fluid, as heat is removed from themulti-phase thermally conductive fluid 108 disposed inside thepressurized gaseous fluid storage 604, at least a portion of themulti-phase thermally conductive fluid 108 in the gaseous phasecondenses to liquid phase 106 and flows as a liquid to the lower part ofpressurized gaseous fluid storage 604 thereby reducing the pressureinside the pressurized gaseous fluid storage 604 as an effect of saidphase change of the multi-phase thermally conductive fluid from thegaseous phase 108 to the liquid phase 106.

The gaseous and condensed fluid exhaust assembly 608 is comprised of apressure regulator and a controllable pressure relief valve as to allowfluid 106, 108 in gaseous and/or liquid phase that is disposed in thepressurized gaseous fluid storage 604 to be discharged into theinnermost volume 150 when conditions exist such as a) a specific commandto act is issued by control systems, b) pressure in innermost volume 150falls below a specified value, c) a sensor internal to the pressurizedgaseous fluid storage 604 detects a liquid condensation level abovespecified value, d) a required operation prior to the operation of thegaseous fluid compressor 602, e) after powering up or before poweringdown the system of electronic devices 104, or f) other conditions asrequired by safety or operational status with said discharge actioncontinuing until such time as a) a sensor internal to the pressurizedgaseous fluid storage 604 detects a liquid condensation level belowspecified value, b) pressure in the innermost volume 150 rise above aspecified value, or c) other conditions as required by safety oroperational status.

An optional heat exchanger 1310 comprising a concentric tube, shell andtube, plate, fin, plate-fin, or tube-fin heat exchanger removes heatfrom pressurized gaseous fluid storage 604. The pressurized gaseousfluid storage 604 may be comprised of thermally conductive materialsconfigured to effect supplemental heat removal from the fluid 108 thatis disposed internally to the pressurized gaseous fluid storage 604. Theheat exchanger 1310 may be positioned partially or completely inside oroutside of the sealed enclosure. The pressurized gaseous fluid storage604 is cooled by the secondary thermally conductive fluid 120 that isreturned from the secondary fluid heat exchanger 130 via connecting line134 and flows through the heat exchanger 1310. In embodiments withmulti-phase thermally conductive fluid, the cooled pressurized gaseousfluid storage 604 serves to remove heat from the multi-phase thermallyconductive fluid 108 that is confined in the pressurized gaseous fluidstorage 604 which may further serve to condense multi-phase thermallyconductive fluid from the gaseous phase 108 into the liquid phase 106 ofsaid fluid, thereby reducing the pressure inside the pressurized gaseousfluid storage 604 as an effect of said phase change of the multi-phasethermally conductive fluid from the gaseous phase 108 to the liquidphase 106.

The fluid exchange sealed entrance assembly 408 and the fluid exchangesealed exhaust assembly 406 work in concert to allow primary dielectricthermally conductive fluid 106, 108 fluid to be exchanged between thesealed enclosure and a pressure balancing system 304, maintaining asealed enclosure environment. The pressure balancing system 304 isclosed loop system that is an adjacently located or remote system thatfunctions to maintain an appropriate fluid presence and pressure at thefluid exchange sealed entrance assembly 408 and the fluid exchangesealed exhaust assembly 406 for one or more sealed enclosures viaconnecting lines. The pressure balancing system 304 is capable ofsupplying fluid pressure to the innermost volume 150 of the sealedenclosure using the fluid exchange sealed entrance assembly 408 viaconnecting lines. The fluid exchange sealed entrance assembly 408 may beconfigured with a pressure relief valve assembly that allows fluidpressure to be released from the pressure balancing system 304 into theinnermost volume 150 of the sealed enclosure when the fluid pressure inthe innermost volume 150 of the sealed enclosure falls below a specifiedvalue thereby raising the fluid pressure in the innermost volume 150 ofthe sealed enclosure. The fluid exchange sealed entrance assembly 408may be optionally configured with a pressure regulator allowing thepressure balancing system 304 to distribute a high fluid pressure tosaid pressure regulator which reduces the fluid pressure to appropriatefluid pressure level for proper pressure relief valve operation. Thefluid exchange sealed entrance assembly 408 may be located either insideor outside the sealed enclosure. The pressure balancing system 304 iscapable of removing fluid pressure from the innermost volume 150 of thesealed enclosure using the fluid exchange sealed exhaust assembly 406via connecting lines. The fluid exchange sealed exhaust assembly 406 maybe configured with a pressure relief valve assembly that allows fluidpressure to be released from innermost volume 150 of the sealedenclosure into the fluid pressure collection functionality of thepressure balancing system 304 when the fluid pressure in the innermostvolume 150 of the sealed enclosure rises above a specified value therebylowering the fluid pressure in the innermost volume 150 of the sealedenclosure. The fluid exchange sealed exhaust assembly 406 may be locatedeither inside or outside the sealed enclosure.

An optional heat exchanger 1101 may wrap around the fluid exchangesealed exhaust assembly 406 positioned either inside or outside of thesealed enclosure in which the fluid exchange sealed exhaust assembly 406includes a heat exchanger comprising a concentric tube, shell and tube,plate, fin, plate-fin, or tube-fin heat exchanger and is configured toeffect supplemental heat removal from the primary dielectric thermallyconductive fluid 106, 108 that is transported through the fluid exchangesealed exhaust assembly 406. Such configuration of the fluid exchangesealed exhaust assembly 406 is cooled by the secondary thermallyconductive fluid 120 that is returned from the secondary fluid heatexchanger 130 via connecting line 134 and flows through the heatexchanger 1101 and around a portion of the fluid exchange sealed exhaustassembly 406. The cooled fluid exchange sealed exhaust assembly 406serves to remove heat from the primary dielectric thermally conductivefluid 106, 108 that is transported through the fluid exchange sealedexhaust assembly 406 which may further serve to condense multi-phaseprimary dielectric thermally conductive fluid from the gaseous phase 108into the liquid phase 106 of said fluid, with the result of returningthe multi-phase primary dielectric thermally conductive fluid 106 in theliquid phase back into the sealed enclosure by gravity flow or othermechanical means in order to maintain a proper amount of primarydielectric thermally conductive fluid 106 within the sealed enclosure.

Optional mechanisms may be additionally configured in the innermostvolume 150 of the sealed enclosure in order to effect the circulation ofthe primary dielectric thermally conductive fluid 106 for the purpose ofa) circulating the primary dielectric thermally conductive fluid 106 inorder to more effectively transfer thermal energy from the enclosedelectronic devices 104 to the primary dielectric thermally conductivefluid 106 and the enclosure wall 901, and b) to circulate the primarydielectric thermally conductive fluid 106 through at least one filter totrap impurities and particulates, embodiments of such mechanismscomprise a) a mechanism comprised of a fluid pump 310, a pump intake312, and a pump discharge 314, or b) a mechanism comprised of animpeller, fan, turbine, or propeller that rotates under motive force.

FIG. 14 shows a conceptual view of an internal pressure balancingmechanism with dual port pressure balancing mechanism used to relievepositive and negative pressures in a sealed enclosure and optionalpressurized gaseous fluid driven primary dielectric thermally conductivefluid pump and bubbler circulation mechanisms. The sealed enclosureshown in the figure is typical of the disclosures described in FIG. 9and is illustrated by showing only a portion of such sealed enclosure asa figure with an enclosure wall 901, wherein the innermost volume 150contains a primary dielectric thermally conductive fluid 106, 108 thateither completely or partially fills the interior of the sealedenclosure as shown.

Pressure equalization of the innermost volume 150 of the sealedenclosure as well as optional fluid management is provided by a) one ormore first mechanisms comprised of gaseous fluid compressor 602,pressurized gaseous fluid storage 604, gaseous fluid entrance assembly606, gaseous and condensed fluid exhaust assembly 608, and associatedconnecting lines, valves, sensors, controls, wiring, power, enclosures,and regulators, and b) an optional second mechanism comprised of fluidexchange sealed entrance assembly 408, fluid exchange sealed exhaustassembly 406, pressure balancing system 304, and associated connectinglines, valves, sensors, controls, wiring, power, enclosures, andregulators such that if said first mechanisms and said second mechanismare present in an embodiment, one of the said mechanisms may bedesignated as the primary functional mechanism while the remaining saidmechanisms are designated as secondary functional mechanisms, or all ofthe said mechanisms may be designated as the primary functionalmechanisms. The gaseous fluid compressor 602, pressurized gaseous fluidstorage 604, gaseous fluid entrance assembly 606, gaseous and condensedfluid exhaust assembly 608, and/or fluid exchange sealed entranceassembly 408, fluid exchange sealed exhaust assembly 406, and pressurebalancing system 304 may be configured to function with any primarydielectric thermally conductive fluid, but is used advantageously in theembodiments that contain a) single phase primary dielectric thermallyconductive fluid 106 in the liquid phase, said fluid filling less thanthe entirety of innermost volume 150 with the remaining volume filled byat least one separate and distinct fluid in the gaseous phase 108, b)single phase thermally conductive fluid 106 in the gaseous phase, saidfluid filling the entirety of innermost volume 150, or c) multi-phaseprimary dielectric thermally conductive fluid 106, said fluid at leastpartially filling the innermost volume 150 with portions of said fluidexisting in the liquid phase 106 and portions of said fluid existing inthe gaseous phase 108 in varying proportions relative to thetemperature, pressure, and composition of said multi-phase primarydielectric thermally conductive fluid 106 and if said multi-phaseprimary dielectric thermally conductive fluid 106, 108 fills less thanthe entirety of innermost volume 150, the remaining volume may be filledby at least one separate and distinct fluid in the gaseous phase 108.

The gaseous fluid compressor 602, pressurized gaseous fluid storage 604,gaseous fluid entrance assembly 606, and gaseous and condensed fluidexhaust assembly 608 work in concert to allow gaseous fluid that ispresent in the innermost volume 150 of the sealed enclosure to becompressed and stored for release back into the innermost volume 150 ofthe sealed enclosure as necessary to maintain a specified range of fluidpressure within the innermost volume 150 of the sealed enclosure. Thegaseous fluid entrance assembly 606 may comprise a a) check valve thatallows only fluid in the gaseous phase to flow into the intake of thegaseous fluid compressor 602, or b) a pressure relief valve that allowspressure to be a specified amount greater in innermost volume 150 thanthe pressure in the intake of the gaseous fluid compressor 602. When thefluid pressure in the innermost volume 150 of the sealed enclosure risesabove a specified value, the gaseous fluid compressor 602 is activatedand gaseous fluid 108 flows through the gaseous fluid entrance assembly606 into the intake of the gaseous fluid compressor 602 where suchgaseous fluid is compressed by the gaseous fluid compressor 602 andstored in pressurized gaseous fluid storage 604 thereby lowering thefluid pressure in the innermost volume 150 of the sealed enclosure.

The pressurized gaseous fluid storage 604 may be comprised of thermallyconductive materials configured to effect supplemental heat removal fromthe compressed gaseous fluid 108 by configurations comprisingconstruction methodology or optional heat exchanger 1310. In embodimentswith multi-phase thermally conductive fluid, as heat is removed from themulti-phase thermally conductive fluid 108 disposed inside thepressurized gaseous fluid storage 604, at least a portion of themulti-phase thermally conductive fluid 108 in the gaseous phasecondenses to liquid phase 106 and flows as a liquid to the lower part ofpressurized gaseous fluid storage 604 thereby reducing the pressureinside the pressurized gaseous fluid storage 604 as an effect of saidphase change of the multi-phase thermally conductive fluid from thegaseous phase 108 to the liquid phase 106.

The gaseous and condensed fluid exhaust assembly 608 is comprised of apressure regulator and a controllable pressure relief valve as to allowfluid 106, 108 in gaseous and/or liquid phase that is disposed in thepressurized gaseous fluid storage 604 to be discharged into theinnermost volume 150 when conditions exist such as a) a specific commandto act is issued by control systems, b) pressure in innermost volume 150falls below a specified value, c) a sensor internal to the pressurizedgaseous fluid storage 604 detects a liquid condensation level abovespecified value, d) a required operation prior to the operation of thegaseous fluid compressor 602, e) after powering up or before poweringdown the system of electronic devices 104, or f) other conditions asrequired by safety or operational status with said discharge actioncontinuing until such time as a) a sensor internal to the pressurizedgaseous fluid storage 604 detects a liquid condensation level belowspecified value, b) pressure in the innermost volume 150 rise above aspecified value, or c) other conditions as required by safety oroperational status.

An optional heat exchanger 1310 comprising a concentric tube, shell andtube, plate, fin, plate-fin, or tube-fin heat exchanger removes heatfrom pressurized gaseous fluid storage 604. The pressurized gaseousfluid storage 604 may be comprised of thermally conductive materialsconfigured to effect supplemental heat removal from the fluid 108 thatis disposed internally to the pressurized gaseous fluid storage 604. Theheat exchanger 1310 may be positioned partially or completely inside oroutside of the sealed enclosure. The pressurized gaseous fluid storage604 is cooled by the secondary thermally conductive fluid 120 that isreturned from the secondary fluid heat exchanger 130 via connecting line134 and flows through the heat exchanger 1310. In embodiments withmulti-phase thermally conductive fluid, the cooled pressurized gaseousfluid storage 604 serves to remove heat from the multi-phase thermallyconductive fluid 108 that is confined in the pressurized gaseous fluidstorage 604 which may further serve to condense multi-phase thermallyconductive fluid from the gaseous phase 108 into the liquid phase 106 ofsaid fluid, thereby reducing the pressure inside the pressurized gaseousfluid storage 604 as an effect of said phase change of the multi-phasethermally conductive fluid from the gaseous phase 108 to the liquidphase 106.

The fluid exchange sealed entrance assembly 408 and the fluid exchangesealed exhaust assembly 406 work in concert to allow primary dielectricthermally conductive fluid 106, 108 fluid to be exchanged between thesealed enclosure and a pressure balancing system 304, maintaining asealed enclosure environment. The pressure balancing system 304 isclosed loop system that is an adjacently located or remote system thatfunctions to maintain an appropriate fluid presence and pressure at thefluid exchange sealed entrance assembly 408 and the fluid exchangesealed exhaust assembly 406 for one or more sealed enclosures viaconnecting lines. The pressure balancing system 304 is capable ofsupplying fluid pressure to the innermost volume 150 of the sealedenclosure using the fluid exchange sealed entrance assembly 408 viaconnecting lines. The fluid exchange sealed entrance assembly 408 may beconfigured with a pressure relief valve assembly that allows fluidpressure to be released from the pressure balancing system 304 into theinnermost volume 150 of the sealed enclosure when the fluid pressure inthe innermost volume 150 of the sealed enclosure falls below a specifiedvalue thereby raising the fluid pressure in the innermost volume 150 ofthe sealed enclosure. The fluid exchange sealed entrance assembly 408may be optionally configured with a pressure regulator allowing thepressure balancing system 304 to distribute a high fluid pressure tosaid pressure regulator which reduces the fluid pressure to appropriatefluid pressure level for proper pressure relief valve operation. Thefluid exchange sealed entrance assembly 408 may be located either insideor outside the sealed enclosure. The pressure balancing system 304 iscapable of removing fluid pressure from the innermost volume 150 of thesealed enclosure using the fluid exchange sealed exhaust assembly 406via connecting lines. The fluid exchange sealed exhaust assembly 406 maybe configured with a pressure relief valve assembly that allows fluidpressure to be released from innermost volume 150 of the sealedenclosure into the fluid pressure collection functionality of thepressure balancing system 304 when the fluid pressure in the innermostvolume 150 of the sealed enclosure rises above a specified value therebylowering the fluid pressure in the innermost volume 150 of the sealedenclosure. The fluid exchange sealed exhaust assembly 406 may be locatedeither inside or outside the sealed enclosure.

An optional heat exchanger 1101 may wrap around the fluid exchangesealed exhaust assembly 406 positioned either inside or outside of thesealed enclosure in which the fluid exchange sealed exhaust assembly 406includes a heat exchanger comprising a concentric tube, shell and tube,plate, fin, plate-fin, or tube-fin heat exchanger and is configured toeffect supplemental heat removal from the primary dielectric thermallyconductive fluid 106, 108 that is transported through the fluid exchangesealed exhaust assembly 406. Such configuration of the fluid exchangesealed exhaust assembly 406 is cooled by the secondary thermallyconductive fluid 120 that is returned from the secondary fluid heatexchanger 130 via connecting line 134 and flows through the heatexchanger 1101 and around a portion of the fluid exchange sealed exhaustassembly 406. The cooled fluid exchange sealed exhaust assembly 406serves to remove heat from the primary dielectric thermally conductivefluid 106, 108 that is transported through the fluid exchange sealedexhaust assembly 406 which may further serve to condense multi-phaseprimary dielectric thermally conductive fluid from the gaseous phase 108into the liquid phase 106 of said fluid, with the result of returningthe multi-phase primary dielectric thermally conductive fluid 106 in theliquid phase back into the sealed enclosure by gravity flow or othermechanical means in order to maintain a proper amount of primarydielectric thermally conductive fluid 106 within the sealed enclosure.

An optional mechanism may be additionally configured in the innermostvolume 150 of the sealed enclosure in order to effect the circulation ofthe primary dielectric thermally conductive fluid 106 by using fluidpressure to supply the motive force for optional kinetic processes thatcomprise a) fluid circulation by means of a fluid pressure driven pump502, b) fluid circulation by means of a bubbler 506, c) fluidcirculation by means of both a fluid pressure driven pump 502 and abubbler 506, or d) other fluid circulation mechanisms. These optionalmotive force mechanisms are driven by pressured fluid supplied by a)pressurized gaseous fluid storage 604, and/or b) the pressure balancingsystem 304 to the motive force sealed entrance assembly 504 viaconnecting lines. The motive force sealed entrance assembly 504 may beoptionally configured with a pressure regulator allowing the motiveforce fluid pressure source to supply a high pressure fluid to saidpressure regulator which reduces the fluid pressure to appropriate fluidpressure level for the proper operation of the fluid pressure drivenkinetic processes. The motive force sealed entrance assembly 504 may beconfigured with a pressure control valve assembly that allows fluidpressure from the motive force fluid pressure source to be turned on oroff, thereby supplying fluid pressure from the motive force fluidpressure source to kinetic processes such as the fluid pressure drivenpump 502 and/or the bubbler 506 for the purpose of a) circulating theprimary dielectric thermally conductive fluid 106 in order to moreeffectively transfer thermal energy from the enclosed electronic devices104 to the primary dielectric thermally conductive fluid 106 and theenclosure wall 901, and b) to circulate the primary dielectric thermallyconductive fluid 106 through at least one filter to trap impurities andparticulates. Fluid pressure supplied by the motive force fluid pressuresource into the innermost volume 150 of the sealed enclosure via theexhaust of the fluid pressure driven pump 502 and/or the bubbler 506 ismanaged by the designated pressure balancing system. Embodiments thatcirculate the primary dielectric thermally conductive fluid 106 via apumping action are comprised of a fluid pressure driven pump 502connected to the motive force sealed entrance assembly 504, a pumpintake 312, and a pump discharge 314. Embodiments that circulate theprimary dielectric thermally conductive fluid 106 via a bubbling actionare comprised of a bubbler 506 connected to the motive force sealedentrance assembly 504, and a bubbler connecting line 508, said bubbler506 located in the lower part of the innermost volume 150 of the sealedenclosure and comprising a mechanical means of releasing a pressuredfluid in a predominately gaseous phase via a number of bubbler pores ofvarious sizes. If the bubbler 506 and the fluid pressure driven pump 502are both configured in an embodiment, the fluid pressure utilized todrive the bubbler 506 is supplied by the discharge fluid pressure of thefluid pressure driven pump 502 via connection lines 508. The motiveforce sealed entrance assembly 504 may be located either inside oroutside the sealed enclosure.

FIG. 15 shows a conceptual view of channels to direct the flow ofprimary dielectric thermally conductive fluid within a sealed enclosure.The sealed enclosure shown in the figure is typical of the disclosuresdescribed in FIGS. 1, 2, 9 and is illustrated by showing only a portionof such sealed enclosures as a figure with an enclosure wall 1501,wherein the innermost volume 150 contains a primary dielectric thermallyconductive fluid 106, 108 that either completely or partially fills theinterior of the sealed enclosure as shown. The enclosure wall 1501 isthe innermost enclosure wall 101 in FIGS. 1, 2 and the enclosure wall901 in FIG. 9. The innermost volume 150 contains a single phase ormulti-phase primary dielectric thermally conductive fluid 106, 108 inwhich electronic devices 104 to be cooled are immersed or surrounded.The single phase or multi-phase primary dielectric thermally conductivefluid 106, 108 may be in a predominately liquid phase, gaseous phase, orin a combination liquid phase and gaseous phase.

The sealed enclosure may optionally comprise one or more channels 1511,1512 disposed in the innermost volume 150 for the purpose of providingfor increased and directed convective circulation of the of single phaseor multi-phase primary dielectric thermally conductive fluid 106, 108within the innermost volume 150 of the sealed enclosure. Channels 1511,1512 disposed in the innermost volume 150 of the sealed enclosureencourage convective and/or phase separation of the warmer single phaseor multi-phase primary dielectric thermally conductive fluid 106, 108that tends to flow upward in the innermost volume 150 of the sealedenclosure from the cooler single phase or multi-phase primary dielectricthermally conductive fluid 106, 108 that tends to flow downward in theinnermost volume 150 of the sealed enclosure.

Embodiments with a single phase primary dielectric thermally conductivefluid 106 will absorb heat from electronic devices 104 with the resultthat the portion of said single phase primary dielectric thermallyconductive 106 with a higher heat content will move convectively towardthe top of the innermost volume 150. Embodiments with a multi-phaseprimary dielectric thermally conductive fluid 106 will absorb heat fromelectronic devices 104 with the result that a portion of saidmulti-phase primary dielectric thermally conductive fluid 106 isconverted to the gaseous phase 108. The portion of the multi-phaseprimary dielectric thermally conductive fluid 106 that remains in theliquid phase 106 and contains a higher heat content will moveconvectively toward the top of the innermost volume 150. The portion ofthe multi-phase primary dielectric thermally conductive fluid 106 thatis converted to the gaseous phase 108 will have a lower density than thesurrounding fluid and will thus rise toward the top of the innermostvolume 150.

A least one channel 1512 directs rising primary dielectric thermallyconductive fluid in the liquid phase 106 and/or primary dielectricthermally conductive fluid in the gaseous phase 108 toward a verticalriser channel 1511. A least one vertical riser channel 1511 directsrising primary dielectric thermally conductive fluid in the liquid phase106 and/or primary dielectric thermally conductive fluid in the gaseousphase 108 toward the upper portion of the innermost volume 150. Channels1511, 1512 may be configured as heat exchange mechanisms in order toremove a portion of the heat contained in said rising primary dielectricthermally conductive fluid 106, 108. Channels 1511, 1512 may havevarious configurations that are adapted to specific electronic devices104 within the sealed enclosure. Channels 1511, 1512 may serve to directthe primary dielectric thermally conductive fluid 106, 108 surroundingindividual electronic devices 104 or an aggregate of electronic devices104. Channels 1511, 1512 are comprised of structures that may be closelyconnected in order to specifically control the fluid flow or looselyassociated in order to generally control the flow of the primarydielectric thermally conductive fluid 106, 108. Channels 1511, 1512 maybe adapted to function within a sealed enclosure that is installed invarious orientations.

FIG. 16 shows a conceptual view of channels to direct the flow ofprimary dielectric thermally conductive fluid within a sealed enclosure.The sealed enclosure shown in the figure is typical of the disclosuresdescribed in FIGS. 1, 2, 9 and is illustrated by showing only a portionof such sealed enclosures as a figure with an enclosure wall 1501,wherein the innermost volume 150 contains a primary dielectric thermallyconductive fluid 106, 108 that either completely or partially fills theinterior of the sealed enclosure as shown. The enclosure wall 1501 isthe innermost enclosure wall 101 in FIGS. 1, 2 and the enclosure wall901 in FIG. 9. The innermost volume 150 contains a single phase ormulti-phase primary dielectric thermally conductive fluid 106, 108 inwhich electronic devices 104 to be cooled are immersed or surrounded.The single phase or multi-phase primary dielectric thermally conductivefluid 106, 108 may be in a predominately liquid phase, gaseous phase, orin a combination liquid phase and gaseous phase.

The sealed enclosure may optionally comprise one or more channels 1611,1612 disposed in the innermost volume 150 for the purpose of providingfor increased and directed convective circulation of the of single phaseor multi-phase primary dielectric thermally conductive fluid 106, 108within the innermost volume 150 of the sealed enclosure. Channels 1611,1612 disposed in the innermost volume 150 of the sealed enclosureencourage convective and/or phase separation of the warmer single phaseor multi-phase primary dielectric thermally conductive fluid 106, 108that tends to flow upward in the innermost volume 150 of the sealedenclosure from the cooler single phase or multi-phase primary dielectricthermally conductive fluid 106, 108 that tends to flow downward in theinnermost volume 150 of the sealed enclosure.

Embodiments with a single phase primary dielectric thermally conductivefluid 106 will absorb heat from electronic devices 104 with the resultthat the portion of said single phase primary dielectric thermallyconductive 106 with a higher heat content will move convectively towardthe top of the innermost volume 150. Embodiments with a multi-phaseprimary dielectric thermally conductive fluid 106 will absorb heat fromelectronic devices 104 with the result that a portion of saidmulti-phase primary dielectric thermally conductive fluid 106 isconverted to the gaseous phase 108. The portion of the multi-phaseprimary dielectric thermally conductive fluid 106 that remains in theliquid phase 106 and contains a higher heat content will moveconvectively toward the top of the innermost volume 150. The portion ofthe multi-phase primary dielectric thermally conductive fluid 106 thatis converted to the gaseous phase 108 will have a lower density than thesurrounding fluid and will thus rise toward the top of the innermostvolume 150.

A least one channel 1612 directs rising primary dielectric thermallyconductive fluid in the liquid phase 106 and/or primary dielectricthermally conductive fluid in the gaseous phase 108 toward a verticalriser channel 1611. A least one vertical riser channel 1611 directsrising primary dielectric thermally conductive fluid in the liquid phase106 and/or primary dielectric thermally conductive fluid in the gaseousphase 108 toward the upper portion of the innermost volume 150. Channels1611, 1612 may be configured as heat exchange mechanisms in order toremove a portion of the heat contained in said rising primary dielectricthermally conductive fluid 106, 108. Channels 1611, 1612 may havevarious configurations that are adapted to specific electronic devices104 within the sealed enclosure. Channels 1611, 1612 may serve to directthe primary dielectric thermally conductive fluid 106, 108 surroundingindividual electronic devices 104 or an aggregate of electronic devices104. Channels 1611, 1612 are comprised of structures that may be closelyconnected in order to specifically control the fluid flow or looselyassociated in order to generally control the flow of the primarydielectric thermally conductive fluid 106, 108. Channels 1611, 1612 maybe adapted to function within a sealed enclosure that is installed invarious orientations.

FIG. 17 shows a conceptual view of structures for the volumetricdisplacement of primary dielectric thermally conductive fluid within asealed enclosure. The sealed enclosure shown in the figure is typical ofthe disclosures described in FIGS. 1, 2, 9 and is illustrated by showingonly a portion of such sealed enclosures as a figure with an enclosurewall 1501, wherein the innermost volume 150 contains a primarydielectric thermally conductive fluid 106, 108 that either completely orpartially fills the interior of the sealed enclosure as shown. Theenclosure wall 1501 is the innermost enclosure wall 101 in FIGS. 1, 2and the enclosure wall 901 in FIG. 9. The innermost volume 150 containsa single phase or multi-phase primary dielectric thermally conductivefluid 106, 108 in which electronic devices 104 to be cooled are immersedor surrounded. The single phase or multi-phase primary dielectricthermally conductive fluid 106, 108 may be in a predominately liquidphase, gaseous phase, or in a combination liquid phase and gaseousphase.

Electronic devices 104 are typically characterized by circuit boardconstruction that projects an uneven profile perpendicular to the planeof the circuit board thereby creating a volume of unused space aboveand/or below to the plane of the circuit board (“Electronic DeviceSpace”) for a particular electronic device 104. Electronic devices 104may have at least one associated Electronic Device Space. An ElectronicDevice Space for a particular electronic device 104 is defined by theplane area of the circuit board and a maximum perpendicular height ofthe board components in a specified direction and does not include thevolumetric space that the board components occupy in said directionperpendicular to the plane of the circuit board. The Electronic DeviceSpace may define both a volume and a specific dimensionality thatconforms to a particular electronic device 104.

The sealed enclosure may optionally comprise one or more spacers 1701comprised of solid or sealed hollow structures that are disposed in theinnermost volume 150 within the primary dielectric thermally conductivefluid 106, 108. Spacers 1701 may be configured to function in anylocation within the innermost volume 150, but are used advantageously inembodiments in which the spacer 1701 is disposed in a) Electronic DeviceSpace, b) volumes outside of Electronic Device Space that are locatedbetween electronic devices 104, and c) volumes within the innermostvolume 150 that would otherwise be occupied by the primary dielectricthermally conductive fluid 106, 108.

Spacers 1701 that are disposed within Electronic Device Space of aparticular electronic device 104 may have a dimensionality that forms areflected image of at least a portion of the surface of said electronicdevice 104 such that a) an appropriate gap exists between said reflectedimage and said surface of said electronic device 104 as determine by thebest practices use of the primary dielectric thermally conductive fluid106, 108, b) portions of said reflected image are in direct thermalcontact with said surface of said electronic device 104, c) portions ofsaid reflected image are in indirect thermal contact with said surfaceof said electronic device 104 having thermal interface materialsdisposed between said portions of said reflected image and said surfaceof said electronic device 104, and d) portions of said reflected imageare in direct mechanical contact with said surface of said electronicdevice 104. A spacer 1701 may be disposed within the Electronic DeviceSpace of one or more electronic devices 104. One or more spacers 1701may be disposed with the Electronic Device Space of a particularelectronic device 104.

Spacers 1701 may be thermally connected to electronic devices 104 andconfigured as heat exchange mechanisms to transport heat from saidelectronic device 104 to the primary dielectric thermally conductivefluid 106, 108 or to transport heat directly to heat exchange ortransport mechanisms illustrated in FIGS. 1 to 16 inclusive. Spacers1701 may be mechanically connected to electronic devices 104 or otherobjects disposed with the innermost volume 150. Spacers 1701 may beconfigured to function as channels as disclosure in FIGS. 15, 16.Spacers 1701 may be configured such that at least a portion of a spacer1701 comprises a elastic diaphragm, elastic wall materials, or hollowelastic structure that allow at least a portion of the spacer 1701 todeform under pressure. Spacers 1701 may be constructed of materialssuitable to their purpose and may be comprised of a plurality ofdistinct materials and parts.

FIG. 18 shows a conceptual view of mechanisms that provide a means ofrendering a portion of the electronic devices with a sealed enclosureand any content stored on those devices to be permanently unusable andunreadable. The sealed enclosure shown in the figure is typical of thedisclosures described in FIGS. 1, 2, 9 and is illustrated by showingonly a portion of such sealed enclosures as a figure with an enclosurewall 1501, wherein the innermost volume 150 contains a primarydielectric thermally conductive fluid 106, 108 that either completely orpartially fills the interior of the sealed enclosure as shown. Theenclosure wall 1501 is the innermost enclosure wall 101 in FIGS. 1, 2and the enclosure wall 901 in FIG. 9. The innermost volume 150 containsa single phase or multi-phase primary dielectric thermally conductivefluid 106, 108 in which electronic devices 104 to be cooled are immersedor surrounded. The single phase or multi-phase primary dielectricthermally conductive fluid 106, 108 may be in a predominately liquidphase, gaseous phase, or in a combination liquid phase and gaseousphase.

The sealed enclosure may optionally comprise one or more mechanisms1801, 1802, 1803 in the innermost volume 150 for the purpose ofproviding an electrical, magnetic, chemical, and/or mechanical means ofrendering the electronic devices 104 and any content stored on saidelectronic devices 104 to be permanently unusable and unreadable(“Poison Pill Device”). Poison Pill Devices 1801, 1802, 1803 may beconfigured to function in any location within the innermost volume 150.

Poison Pill Device 1801 is an assembly comprising a frangible containerthat contains a material destructive to electronic devices 104 and amotive force actuated striker that will operate on command to strike thefrangible container with kinetic force sufficient to break the frangiblecontainer and release the contents of the frangible container into theinnermost volume 150 of the sealed enclosure. The striker of Poison PillDevice 1801 may use electrical, pneumatic, mechanical, or inertial meansto supply the motive force necessary to operate the striker. Thefrangible container of Poison Pill Device 1801 holds caustic, corrosive,or conductive materials that when added to the primary dielectricthermally conductive fluid 106, 108 serve to at least partially renderthe electrical devices 104 permanently unusable and unreadable. In atleast one embodiment, a plurality of Poison Pill Devices 1801 aredisposed in various locations within the innermost volume 150 so as tohave the greatest effect on electronic devices 104.

A Poison Pill Device 1802 is an assembly comprising a mechanical meansof deforming electronic devices 104 that are disposed between at leastone movable structural member by subjecting said electronic devices 104to compression or tension that results in the physical destruction of aportion of said electronic devices 104. The motive force for themoveable structural member of Poison Pill Device 1802 is comprised of a)a screw and motor assembly configured as moving plate, scissor jack, orjack screw, b) a striker assembly with at least one motive forceactuated striker, or c) a lever or cylinder acting in mechanicaladvantage with electrical, inertial, or fluid pressure motive force.

A Poison Pill Device 1803 is an assembly comprising a magnetic means ofdestroying electronic devices 104 that are disposed in proximity with atleast one electromagnet of sufficient strength to render said electronicdevices 104 and any content stored on said electronic devices 104 to bepermanently unusable and unreadable. In at least one embodiment, aplurality of Poison Pill Devices 1803 are disposed in various locationswithin the innermost volume 150 so as to have the greatest effect onelectronic devices 104.

Poison Pill Devices 1801, 1802, 1803 may be commanded to act by at leastone control that includes remote control of an electronic device 104,proximal electrical or mechanical control disposed on the exterior ofthe sealed enclosure, or autonomous control with a determination basedon specific events and circumstances detected by electronic devices 104and/or the Poison Pill Devices 1801, 1802, 1803. Poison Pill Devices1801, 1802, 1803 may be commanded to act in sequence and timing tomaximize the destructive effect of the Poison Pill Devices 1801, 1802,1803. Poison Pill Devices 1801, 1802, 1803 may use other assemblies andmechanisms with the innermost volume 150 to increase the desired effectby using actions comprising mixing, pressure changes, electricalcontrol, and electrical impulse. Poison Pill Devices 1801, 1802, 1803may be simultaneously commanded to act by a plurality of means. PoisonPill Devices 1801, 1802, 1803 may require that a plurality of means ofcommand are in agreement in order to initiate action.

Not shown, but disclosed is external means of effecting the sealedenclosure for the purpose of providing an electrical, magnetic,chemical, and/or mechanical means of rendering the electronic devices104 and any content stored on said devices to be permanently unusableand unreadable, said external means comprising a) the introduction ofcaustic, corrosive, or conductive materials into the primary dielectricthermally conductive fluid 106, 108 by means an external pressurebalancing system 304, b) electrical impulse introduced by means ofcontrol wiring 110, c) mechanical or thermal deformation by electrical,mechanical, or chemical means, and d) cessation of effective operationof an external heat exchanger assembly 130, 240.

Although example diagrams to implement the elements of the disclosedsubject matter have been provided, one skilled in the art, using thisdisclosure, could develop additional embodiments to practice thedisclosed subject matter and each is intended to be included herein.

In addition to the above described embodiments, those skilled in the artwill appreciate that this disclosure has application in a variety ofarts and situations and this disclosure is intended to include the same.

What is claimed is:
 1. A system for facilitating transfer of thermalenergy from a volume of a containment vessel, said system comprising:said containment vessel enclosing the volume, said volume being sealed;a primary dielectric thermally conductive fluid at least partiallyfilling said volume of said containment vessel; at least oneheat-generating electronic device disposed within said sealed volume ofsaid containment vessel; an inner pressure balancing mechanism formaintaining at least one of a pressure or a fluid level of said primarydielectric thermally conductive fluid within appropriate operationallimits of said primary dielectric thermally conductive fluid, said innerpressure balancing mechanism disposed only within said volume of saidcontainment vessel, wherein said inner pressure balancing mechanismcomprises a gaseous fluid compressor and a pressurized gaseous fluidstorage; and at least one access fluid-tight entrance through a wall ofsaid containment vessel to said volume of said containment vessel forproviding access for at least one of: power cable; control cable; datacable; communications cable; or signal cable.
 2. The system of claim 1,wherein said primary dielectric thermally conductive fluid is amulti-phased fluid.
 3. The system of claim 1, said containment vesselfurther comprises at least one secondary fluid fluid-tight entrancethrough said wall to said at least one said volume and at least onesecondary thermally conductive fluid disposed in at least one heatexchange mechanism, said at least one heat exchange mechanism disposedwith said volume of said containment vessel.
 4. The system of claim 3,wherein said at least one secondary thermally conductive fluid is amulti-phased fluid.
 5. The system of claim 3, wherein said at least onesecondary thermally conductive fluid is circulated away from saidcontainment vessel to a heat exchange unit disposed external to saidcontainment vessel.
 6. The system of claim 1, further comprises anexternal pressure balancing system including at least one externalpressure balancing fluid-tight entrance through said wall of saidcontainment vessel to said volume of said containment vessel formaintaining the at least one of the pressure or the fluid level of saidprimary dielectric thermally conductive fluid within the appropriateoperational limits of said primary dielectric thermally conductivefluid.
 7. The system of claim 6, wherein said external pressurebalancing system includes a means for accomplishing vapor condensationof said primary dielectric thermally conductive fluid, said means foraccomplishing vapor condensation disposed exterior to said volume ofsaid containment vessel.
 8. The system of claim 1, wherein said volumeof said volume of said containment vessel comprises at least one channelfor directing a flow of said primary dielectric thermally conductivefluid within said volume of said containment vessel.
 9. The system ofclaim 1, wherein said containment vessel further comprises solid orsealed hollow structures disposed in said volume of said containmentvessel for a volumetric displacement of said primary dielectricthermally conductive fluid disposed within said containment vessel. 10.The system of claim 1, said containment vessel further comprises a meansfor rendering inoperable said at least one heat-generating electronicdevice disposed within said volume of said containment vessel, saidmeans for rendering inoperable commanded to act by remote control orbased upon specific events and/or circumstances detected by said atleast one heat-generating electronic device.
 11. A method forfacilitating transfer of thermal energy from a volume of a containmentvessel, said method comprising: providing the containment vesselenclosing the volume, said volume being sealed; filling at leastpartially said volume of said containment vessel with a primarydielectric thermally conductive fluid; disposing at least oneheat-generating electronic device within said sealed volume of saidcontainment vessel; disposing an inner pressure balancing mechanism formaintaining at least one of a pressure or a fluid level of said primarydielectric thermally conductive fluid within appropriate operationallimits of said primary dielectric thermally conductive fluid, said innerpressure balancing mechanism disposed only within said volume of saidcontainment vessel, wherein said inner pressure balancing mechanismcomprises a gaseous fluid compressor and a pressurized gaseous fluidstorage; and disposing at least one access fluid-tight entrance througha wall of said containment vessel to said volume of said containmentvessel for providing access for at least one of: power cable; controlcable; data cable; communications cable; or signal cable.
 12. The methodof claim 11, wherein said primary dielectric thermally conductive fluidis a multi-phased fluid.
 13. The method of claim 11, said providing saidcontainment vessel further comprises disposing at least one secondaryfluid fluid-tight entrance through said wall to said at least one saidvolume and disposing at least one secondary thermally conductive fluiddisposed in at least one heat exchange mechanism, said at least one heatexchange mechanism disposed with said volume of said containment vessel.14. The method of claim 13, wherein said at least one secondarythermally conductive fluid is a multi-phased fluid.
 15. The method ofclaim 13, wherein said at least one secondary thermally conductive fluidis circulated away from said containment vessel to a heat exchange unitdisposed external to said containment vessel.
 16. The method of claim11, further comprises disposing an external pressure balancing systemincluding at least one external pressure balancing fluid-tight entrancethrough said wall of said containment vessel to said volume of saidcontainment vessel for maintaining the at least one of the pressure orthe fluid level of said primary dielectric thermally conductive fluidwithin the appropriate operational limits of said primary dielectricthermally conductive fluid.
 17. The method of claim 16, wherein saiddisposing said external pressure balancing system includes disposing avapor condensation apparatus exterior to said volume of said containmentvessel, the vapor condensation apparatus accomplishing vaporcondensation of said primary dielectric thermally conductive fluid. 18.The method of claim 11, wherein said volume of said containment vesselcomprises disposing at least one channel for directing a flow of saidprimary dielectric thermally conductive fluid within said volume of saidcontainment vessel.
 19. The method of claim 11, wherein said providingsaid containment vessel further comprises disposing solid or sealedhollow structures in said volume of said containment vessel for avolumetric displacement of said primary dielectric thermally conductivefluid disposed within said containment vessel.
 20. The method of claim11, said providing said containment vessel further comprises renderinginoperable said at least one heat-generating electronic device disposedwithin said containment vessel, said rendering inoperable beingcommanded to act by remote control or based upon specific events and/orcircumstances detected by said at least one heat-generating electronicdevice.